Ishizaka; Tsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishizaka; Tsuyoshi.The latest application filed is for "sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape".

Company Profile

2.4.10

Ishizaka; Tsuyoshi - Ibaraki JP
Ishizaka; Tsuyoshi - Ibaraki-shi Osaka

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape Grant 10,301,509 - Sugo , et al.	2019-05-28
Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device Grant 10,128,131 - Shiga , et al. November 13, 2	2018-11-13
Sheet For Thermal Bonding And Sheet For Thermal Bonding With Affixed Dicing Tape App 20170369744 - Sugo; Yuki ; et al.	2017-12-28
Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package Grant 9,659,883 - Morita , et al. May 23, 2	2017-05-23
Method For Producing Semiconductor Package App 20170125373 - Morita; Kosuke ; et al.	2017-05-04
Sealing Sheet Provided With Double-sided Separator, And Method For Manufacturing Semiconductor Device App 20170040187 - Iino; Chie ; et al.	2017-02-09
Electronic Component Device Production Method And Electronic Component Sealing Sheet App 20170040287 - Shiga; Goji ; et al.	2017-02-09
Production Method For Semiconductor Package App 20170033076 - Morita; Kosuke ; et al.	2017-02-02
Production Method For Semiconductor Package App 20170032979 - Morita; Kosuke ; et al.	2017-02-02
Sealing Sheet With Separators On Both Surfaces, And Method For Manufacturing Semiconductor Device App 20160300733 - Shiga; Goji ; et al.	2016-10-13
Thermally Curable Resin Sheet For Sealing Semiconductor Chip, And Method For Manufacturing Semiconductor Package App 20160211228 - Morita; Kosuke ; et al.	2016-07-21
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Using The Same App 20100308477 - AKIZUKI; Shinya ; et al.	2010-12-09
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby Grant 7,268,191 - Toyoda , et al. September 11, 2	2007-09-11
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby App 20050154152 - Toyoda, Eiji ; et al.	2005-07-14

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