ISHIZAKA; Hitoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for ISHIZAKA; Hitoshi.The latest application filed is for "hydrogen production method and hydrogen production system".

Company Profile

0.10.15

ISHIZAKA; Hitoshi - Suzuka-shi JP
ISHIZAKA; Hitoshi - Kyoto-shi JP
Ishizaka; Hitoshi - Kyoto N/A JP
Ishizaka; Hitoshi - Ibaraki-shi JP
Ishizaka; Hitoshi - Ibaraki JP
Ishizaka; Hitoshi - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hydrogen Production Method And Hydrogen Production System App 20160318761 - HIRAO; Kazuyuki ; et al.	2016-11-03
Power Supply Device App 20150244186 - UMEMURA; Takuya ; et al.	2015-08-27
Fuel cell, and method for manufacturing the same Grant 8,697,300 - Sugimoto , et al. April 15, 2	2014-04-15
Fuel Cell, And Method For Manufacturing The Same App 20110027667 - Sugimoto; Masakazu ; et al.	2011-02-03
Cleaning Sheet, Conveying Member Using The Same, And Substrate Processing Equipment Cleaning Method Using Them App 20100319151 - Namikawa; Makoto ; et al.	2010-12-23
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them Grant 7,793,668 - Namikawa , et al. September 14, 2	2010-09-14
Separator for fuel cell and fuel cell using the same Grant 7,632,599 - Ouchi , et al. December 15, 2	2009-12-15
Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon App 20090242506 - Nakamura; Kei ; et al.	2009-10-01
Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon Grant 7,561,434 - Nakamura , et al. July 14, 2	2009-07-14
Tape carrier for TAB Grant 7,358,619 - Ishizaka April 15, 2	2008-04-15
Cleaning member for semiconductor apparatus and process for producing the same App 20070163621 - Ishizaka; Hitoshi ; et al.	2007-07-19
Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon App 20070108631 - Nakamura; Kei ; et al.	2007-05-17
Tape Carrier For TAB And Method Of Manufacturing The Same App 20070045790 - Ishizaka; Hitoshi	2007-03-01
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them App 20060105164 - Namikawa; Makoto ; et al.	2006-05-18
Boring method for circuit board Grant 7,006,879 - Ishizaka February 28, 2	2006-02-28
Wired circuit board App 20050260391 - Nakamura, Kei ; et al.	2005-11-24
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them App 20050244632 - Namikawa, Makoto ; et al.	2005-11-03
Separator for fuel cell and fuel cell using the same App 20050026028 - Ouchi, Kazuo ; et al.	2005-02-03
Metal transfer sheet, producing method thereof, and producing method of ceramic condenser App 20030219608 - Ishizaka, Hitoshi ; et al.	2003-11-27
Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board Grant 6,642,478 - Nishida , et al. November 4, 2	2003-11-04
Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board App 20030057193 - Nishida, Kanji ; et al.	2003-03-27
Boring method for circuit board App 20020050055 - Ishizaka, Hitoshi	2002-05-02
Flexible wiring board Grant 6,373,709 - Hino , et al. April 16, 2	2002-04-16
Composite tubular article and process for producing the same Grant 5,411,779 - Nakajima , et al. May 2, 1	1995-05-02

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