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name:-0.0025289058685303
name:-0.00066089630126953
Ishiwa; Hideshi Patent Filings

Ishiwa; Hideshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishiwa; Hideshi.The latest application filed is for "long fiber-reinforced polypropylene resin composition and molded article".

Company Profile
0.2.2
  • Ishiwa; Hideshi - Ichihara JP
  • Ishiwa; Hideshi - Chiba JP
  • Ishiwa, Hideshi - Ichihara-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Long fiber-reinforced polypropylene resin composition and molded article
Grant 6,649,685 - Saito , et al. November 18, 2
2003-11-18
Long fiber-reinforced polypropylene resin composition
Grant 6,627,692 - Saito , et al. September 30, 2
2003-09-30
Long fiber-reinforced polypropylene resin composition and molded article
App 20020115779 - Saito, Koichi ;   et al.
2002-08-22
Long fiber-reinforced polypropylene resin composition
App 20020091191 - Saito, Koichi ;   et al.
2002-07-11

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