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name:-0.0064949989318848
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Ishiura; Yutaka Patent Filings

Ishiura; Yutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishiura; Yutaka.The latest application filed is for "vibration structure".

Company Profile
5.5.8
  • Ishiura; Yutaka - Nagaokakyo-shi JP
  • Ishiura; Yutaka - Nagaokakyo JP
  • Ishiura; Yutaka - Kyoto JP
  • Ishiura; Yutaka - Kyoto-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Vibration Structure
App 20220097098 - Endo; Jun ;   et al.
2022-03-31
In-plane Vibration Structure
App 20220035455 - ENDO; Jun ;   et al.
2022-02-03
Fabric and liquid absorbing article
Grant 10,675,186 - Ishiura , et al.
2020-06-09
Piezoelectric film sensor and holding state detecting device
Grant 10,605,678 - Kihara , et al.
2020-03-31
Antibacterial Fiber
App 20190281820 - USUI; Kentaro ;   et al.
2019-09-19
Fabric And Liquid Absorbing Article
App 20190008687 - Ishiura; Yutaka ;   et al.
2019-01-10
Piezoelectric Film Sensor And Holding State Detecting Device
App 20180058954 - KIHARA; TAKASHI ;   et al.
2018-03-01
Dielectric thin film element, antifuse element, and method of producing dielectric thin film element
Grant 9,548,161 - Nakaiso , et al. January 17, 2
2017-01-17
Dielectric thin film element, antifuse element, and method of producing dielectric thin film element
Grant 9,460,859 - Nakaiso , et al. October 4, 2
2016-10-04
Dielectric Thin Film Element, Antifuse Element, And Method Of Producing Dielectric Thin Film Element
App 20160204063 - Nakaiso; Toshiyuki ;   et al.
2016-07-14
Dielectric Thin Film Element, Antifuse Element, And Method Of Producing Dielectric Thin Film Element
App 20130194714 - Nakaiso; Toshiyuki ;   et al.
2013-08-01
Electronic component and manufacturing method thereof
Grant 7,541,722 - Ishiura , et al. June 2, 2
2009-06-02
Electronic Component And Manufacturing Method Thereof
App 20080179991 - Ishiura; Yutaka ;   et al.
2008-07-31

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