Ishitomi; Hiroyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishitomi; Hiroyuki.The latest application filed is for "resistance-formed substrate and method for manufacturing same".

Company Profile

0.8.13

Ishitomi; Hiroyuki - Osaka JP
Ishitomi; Hiroyuki - Takatsuki JP
Ishitomi; Hiroyuki - Takatsuki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resistance-formed Substrate And Method For Manufacturing Same App 20140008104 - Sugaya; Yasuhiro ; et al.	2014-01-09
Multilayer wiring substrate and manufacturing method of multilayer wiring substrate Grant 8,604,350 - Himori , et al. December 10, 2	2013-12-10
Wiring board, wiring board manufacturing method, and via paste Grant 8,563,872 - Hirai , et al. October 22, 2	2013-10-22
Wiring Board, Production Method Of The Same, And Via Paste App 20130068513 - Hirai; Shogo ; et al.	2013-03-21
Multilayer Wiring Board And Production Method Of The Same App 20130062107 - Higuchi; Takayuki ; et al.	2013-03-14
Wiring Board, Wiring Board Manufacturing Method, And Via Paste App 20110290549 - Hirai; Shogo ; et al.	2011-12-01
Multilayer Wiring Substrate And Manufacturing Method Of Multilayer Wiring Substrate App 20110278051 - Himori; Tsuyoshi ; et al.	2011-11-17
Mounting board, mounted body, and electronic equipment using the same Grant 7,667,977 - Sugaya , et al. February 23, 2	2010-02-23
Mounting Board, Mounted Body, and Electronic Equipment Using the Same App 20080290497 - Sugaya; Yasuhiro ; et al.	2008-11-27
Method of producing circuit component built-in module with embedded circuit component Grant 7,140,104 - Hirano , et al. November 28, 2	2006-11-28
Transfer sheet and wiring board using the same, and method of manufacturing the same App 20060078669 - Sugaya; Yasuhiro ; et al.	2006-04-13
Transfer sheet and wiring board using the same, and method of manufacturing the same Grant 7,001,662 - Sugaya , et al. February 21, 2	2006-02-21
Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production App 20050005420 - Hirano, Koichi ; et al.	2005-01-13
Transfer sheet and wiring board using the same, and method of manufacturing the same App 20040191491 - Sugaya, Yasuhiro ; et al.	2004-09-30
Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production Grant 6,787,884 - Hirano , et al. September 7, 2	2004-09-07
Circuit component, circuit component package,, circuit component built-in module, circuit component package production and circuit component built-in module production App 20030222335 - Hirano, Koichi ; et al.	2003-12-04

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