loadpatents
name:-0.0085320472717285
name:-0.0042421817779541
name:-0.0027589797973633
Ishimoto; Tomoko Patent Filings

Ishimoto; Tomoko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishimoto; Tomoko.The latest application filed is for "epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same".

Company Profile
2.5.9
  • Ishimoto; Tomoko - Toyohashi JP
  • ISHIMOTO; Tomoko - Tokyo JP
  • ISHIMOTO; Tomoko - Toyohashi-shi JP
  • Ishimoto; Tomoko - Kumamoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same
Grant 10,501,618 - Ishimoto , et al. Dec
2019-12-10
Epoxy-resin composition and film, prepreg, and fiber-reinforced plastic using same
Grant 9,988,508 - Ishimoto , et al. June 5, 2
2018-06-05
Epoxy Resin Composition, And Film, Prepreg, And Fiber-reinforced Plastic Using Same
App 20170369700 - MITOBE; Hirokazu ;   et al.
2017-12-28
Epoxy-resin composition, and film, prepreg and fiber-reinforced plastic using the same
Grant 9,574,081 - Ishimoto , et al. February 21, 2
2017-02-21
Epoxy Resin Composition, And Film, Prepreg, And Fiber-reinforced Plastic Using Same
App 20160297959 - ISHIMOTO; Tomoko ;   et al.
2016-10-13
Fiber-reinforced Composite Material
App 20150337099 - Kaneko; Manabu ;   et al.
2015-11-26
Fiber-reinforced Composite Material
App 20150328828 - KANEKO; Manabu ;   et al.
2015-11-19
Epoxy-resin Composition, And Film, Prepreg And Fiber-reinforced Plastic Using The Same
App 20150191592 - Ishimoto; Tomoko ;   et al.
2015-07-09
Epoxy-resin Composition And Film, Prepreg, And Fiber-reinforced Plastic Using Same
App 20150175760 - Ishimoto; Tomoko ;   et al.
2015-06-25
Fiber-reinforced Composite Material
App 20120202071 - Kaneko; Manabu ;   et al.
2012-08-09
Method of substrate processing to form a film on multiple target objects
Grant 6,054,181 - Nanbu , et al. April 25, 2
2000-04-25
Semiconductor wafer processing apparatus including localized humidification between coating and heat treatment sections
Grant 5,725,664 - Nanbu , et al. March 10, 1
1998-03-10

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