Ishimatsu; Tomoyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishimatsu; Tomoyuki.The latest application filed is for "anisotropic electrically conductive film, method for producing same, and connection structural body".

Company Profile

10.39.38

Ishimatsu; Tomoyuki - Tochigi JP
Ishimatsu; Tomoyuki - Utsunomiya JP
ISHIMATSU; Tomoyuki - Utsunomiya-shi JP
Ishimatsu; Tomoyuki - Tokyo JP
Ishimatsu; Tomoyuki - Kanuma N/A JP
ISHIMATSU; Tomoyuki - Kanuma-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrical characteristics inspection tool Grant 11,402,408 - Ishimatsu , et al. August 2, 2	2022-08-02
Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure Grant 10,943,879 - Akutsu , et al. March 9, 2	2021-03-09
Anisotropic electrically conductive film, method for producing same, and connection structural body Grant 10,832,830 - Ishimatsu , et al. November 10, 2	2020-11-10
Anisotropic Electrically Conductive Film, Method For Producing Same, And Connection Structural Body App 20200152352 - ISHIMATSU; Tomoyuki ; et al.	2020-05-14
Electrical Characteristics Inspection Tool App 20200141978 - ISHIMATSU; Tomoyuki ; et al.	2020-05-07
Anisotropic conductive film, connected structure, and method for manufacturing a connected structure Grant 10,589,502 - Ishimatsu	2020-03-17
Anisotropic conductive film, manufacturing method thereof, and connection structure Grant 10,575,410 - Haga , et al. Feb	2020-02-25
Anisotropic electrically conductive film, method for producing same, and connection structural body Grant 10,566,108 - Ishimatsu , et al. Feb	2020-02-18
Anisotropic conductive film and production method of the same Grant 10,442,958 - Araki , et al. Oc	2019-10-15
Anisotropic Conductive Film, Connected Structure, And Method For Manufacturing A Connected Structure App 20190308403 - ISHIMATSU; Tomoyuki	2019-10-10
Anisotropic Electrically Conductive Film, Method For Producing Same, And Connection Structural Body App 20190237214 - ISHIMATSU; Tomoyuki ; et al.	2019-08-01
Method for manufacturing anisotropically conductive film, anisotropically conductive film, and conductive structure Grant 10,350,872 - Ishimatsu July 16, 2	2019-07-16
Protective tape and method for manufacturing semiconductor device using the same Grant 10,312,125 - Moriyama , et al.	2019-06-04
Anisotropic electrically conductive film, method for producing same, and connection structural body Grant 10,304,587 - Ishimatsu , et al.	2019-05-28
Thermosetting adhesive sheet and semiconductor device manufacturing method Grant 10,273,386 - Mori , et al.	2019-04-30
Multilayer substrate Grant 10,199,358 - Akutsu , et al. Fe	2019-02-05
Adhesive Composition App 20190016930 - NAMIKI; Hidetsugu ; et al.	2019-01-17
Thermosetting Adhesive Sheet And Semiconductor Device Manufacturing Method App 20180320031 - MORI; Daichi ; et al.	2018-11-08
Thermosetting Adhesive Sheet And Semiconductor Device Manufacturing Method App 20180312728 - MORI; Daichi ; et al.	2018-11-01
Bump-forming Film, Semiconductor Device And Manufacturing Method Thereof, And Connection Structure App 20180218990 - AKUTSU; Yasushi ; et al.	2018-08-02
Protective Tape And Method For Manufacturing Semiconductor Device Using The Same App 20180151405 - MORIYAMA; Hironobu ; et al.	2018-05-31
Anisotropic conductive film, anisotropic conductive film production method, connecting method, and bonded structure Grant 9,924,599 - Ishimatsu March 20, 2	2018-03-20
Multilayer Substrate App 20180026012 - AKUTSU; Yasushi ; et al.	2018-01-25
Multilayer Substrate App 20170358549 - SHINOHARA; Seiichiro ; et al.	2017-12-14
Anisotropic Conductive Film, Manufacturing Method Thereof, And Connection Structure App 20170359904 - HAGA; Kenichi ; et al.	2017-12-14
Anisotropic Electrically Conductive Film, Method For Producing Same, And Connection Structural Body App 20170323701 - ISHIMATSU; Tomoyuki ; et al.	2017-11-09
Protective tape and method for manufacturing a semiconductor device using the same Grant 9,741,598 - Moriyama , et al. August 22, 2	2017-08-22
Anisotropic Conductive Film And Production Method Of The Same App 20170107406 - ARAKI; Yuta ; et al.	2017-04-20
Protective Tape And Method For Manufacturing A Semiconductor Device Using The Same App 20160181140 - MORIYAMA; Hironobu ; et al.	2016-06-23
Anisotropic conductive material and method for manufacturing same Grant 9,253,911 - Tsukao , et al. February 2, 2	2016-02-02
Method For Manufacturing Anisotropically Conductive Film, Anisotropically Conductive Film, And Conductive Structure App 20150208511 - Ishimatsu; Tomoyuki	2015-07-23
Connecting film, and joined structure and method for producing the same Grant 9,023,464 - Akutsu , et al. May 5, 2	2015-05-05
Conductive particle, and anisotropic conductive film, bonded structure, and bonding method Grant 8,987,607 - Ozeki , et al. March 24, 2	2015-03-24
Anisotropic conductive film, joined structure and method for producing the joined structure Grant 8,980,043 - Ishimatsu March 17, 2	2015-03-17
Conductive particle, and anisotropic conductive film, bonded structure, and bonding method Grant 8,932,716 - Ishimatsu , et al. January 13, 2	2015-01-13
Adhesive film, connecting method, and joined structure Grant 8,796,557 - Ishimatsu , et al. August 5, 2	2014-08-05
Anisotropic Conductive Film, Anisotropic Conductive Film Production Method, Connecting Method, And Bonded Structure App 20140168919 - ISHIMATSU; Tomoyuki	2014-06-19
Connecting film, and joined structure and method for producing the same Grant 8,524,032 - Akutsu , et al. September 3, 2	2013-09-03
Anisotropic Conductive Material And Method For Manufacturing The Same App 20130135838 - Tsukao; Reiji ; et al.	2013-05-30
Connection Method And Connection Structure Of Electronic Component App 20130077266 - Tsukao; Reiji ; et al.	2013-03-28
Conductive particle, anisotropic conductive film, joined structure, and joining method Grant 8,395,052 - Ishimatsu , et al. March 12, 2	2013-03-12
Connecting Film, and Joined Structure and Method for Producing the Same App 20130000113 - AKUTSU; Yasushi ; et al.	2013-01-03
Joined structure and method for producing the same Grant 8,330,052 - Ishimatsu , et al. December 11, 2	2012-12-11
Anisotropic Conductive Film, Joined Structure And Method For Producing The Joined Structure App 20120285603 - ISHIMATSU; Tomoyuki	2012-11-15
Connecting film, and joined structure and method for producing the same Grant 8,309,638 - Ishimatsu November 13, 2	2012-11-13
Conductive Particle, And Anisotropic Conductive Film, Bonded Structure, And Bonding Method App 20120279781 - Ozeki; Hiroki ; et al.	2012-11-08
Method for connecting electronic part and joined structure Grant 8,273,207 - Ishimatsu , et al. September 25, 2	2012-09-25
Anisotropic conductive film, joined structure and method for producing the joined structure Grant 8,247,697 - Ishimatsu August 21, 2	2012-08-21
Conductive Particle, And Anisotropic Conductive Film, Bonded Structure, And Bonding Method App 20120090882 - ISHIMATSU; Tomoyuki ; et al.	2012-04-19
Adhesive film, connecting method, and joined structure Grant 8,158,887 - Ishimatsu , et al. April 17, 2	2012-04-17
Joined Structure and Method for Producing the Same App 20120055703 - Ishimatsu; Tomoyuki ; et al.	2012-03-08
Connecting Film, And Joined Structure And Method For Producing The Same App 20110223430 - ISHIMATSU; Tomoyuki	2011-09-15
Anisotropic Electrically Conductive Film And Method For Manufacturing Connection Assembly Using The Same App 20110120767 - Sato; Daisuke ; et al.	2011-05-26
Conductive Particle, Anisotropic Conductive Film, Joined Structure, And Joining Method App 20110088935 - ISHIMATSU; Tomoyuki ; et al.	2011-04-21
Connecting Film, And Joined Structure And Method For Producing The Same App 20100285305 - Akutsu; Yasushi ; et al.	2010-11-11
Adhesive material Grant RE41,784 - Ishimatsu September 28, 2	2010-09-28
Adhesive Film, Connecting Method, And Joined Structure App 20100116533 - Ishimatsu; Tomoyuki ; et al.	2010-05-13
Adhesive Film, Connecting Method, And Joined Structure App 20100096175 - ISHIMATSU; Tomoyuki ; et al.	2010-04-22
Method For Connecting Electronic Part And Joined Structure App 20100080995 - Ishimatsu; Tomoyuki ; et al.	2010-04-01
Anisotropic Conductive Film, Joined Structure And Method For Producing The Joined Structure App 20100065303 - ISHIMATSU; Tomoyuki	2010-03-18
Anisotropic conductive adhesive Grant 6,827,880 - Ishimatsu December 7, 2	2004-12-07
Adhesive material Grant 6,777,478 - Ishimatsu August 17, 2	2004-08-17
Adhesive for connecting electrodes and adhesion methods with the use of the same App 20030029559 - Yamada, Yukio ; et al.	2003-02-13
Anisotropic conductive adhesive App 20020109124 - Ishimatsu, Tomoyuki	2002-08-15
Anisotropic Conductive Adhesive Film App 20020014615 - YAMADA, YUKIO ; et al.	2002-02-07
Anisotropic conductive adhesive film Grant 6,344,156 - Yamada , et al. February 5, 2	2002-02-05
Adhesive material App 20010030022 - Ishimatsu, Tomoyuki	2001-10-18

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.