Ishimaru; Yukihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishimaru; Yukihiro.The latest application filed is for "semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body".

Company Profile

0.27.32

Ishimaru; Yukihiro - Osaka N/A JP
Ishimaru; Yukihiro - Mie N/A JP
Ishimaru; Yukihiro - Hirakata JP
Ishimaru; Yukihiro - Hirakata-shi JP
Ishimaru, Yukihiro - Hirakata city JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
IC current measuring apparatus and IC current measuring adapter Grant 8,878,559 - Nakayama , et al. November 4, 2	2014-11-04
Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body Grant 8,810,035 - Nakamura , et al. August 19, 2	2014-08-19
Module board Grant 8,675,369 - Takatori , et al. March 18, 2	2014-03-18
Semiconductor Bonding Structure Body And Manufacturing Method Of Semiconductor Bonding Structure Body App 20130241069 - Nakamura; Taichi ; et al.	2013-09-19
Ic Current Measuring Apparatus And Ic Current Measuring Adapter App 20120112737 - Nakayama; Takeshi ; et al.	2012-05-10
Module Board App 20120063110 - TAKATORI; Masahiro ; et al.	2012-03-15
Module board Grant 8,077,478 - Takatori , et al. December 13, 2	2011-12-13
Electronic component mounting method and electronic component mounting device Grant 7,752,749 - Shiraishi , et al. July 13, 2	2010-07-13
Package equipped with semiconductor chip and method for producing same Grant 7,649,267 - Shiraishi , et al. January 19, 2	2010-01-19
Circuit Board, Method For Testing Circuit Board, And Method For Manufacturing Circuit Board App 20090202142 - Ishimaru; Yukihiro ; et al.	2009-08-13
Module Having Built-in Electronic Component And Method For Manufacturing Such Module App 20090115067 - Okimoto; Rikiya ; et al.	2009-05-07
Electronic Component Mounting Method and Electronic Component Mounting Device App 20090049687 - Shiraishi; Tsukasa ; et al.	2009-02-26
Electronic Component Module And Method Of Manufacturing The Same App 20080296053 - Ishimaru; Yukihiro ; et al.	2008-12-04
Electronic Component-containing Module And Manufacturing Method Thereof App 20080298023 - Okimoto; Rikiya ; et al.	2008-12-04
Package Equipped with Semiconductor Chip and Method for Producing Same App 20080265437 - Shiraishi; Tsukasa ; et al.	2008-10-30
Module Board App 20080205016 - Takatori; Masahiro ; et al.	2008-08-28
Slave device, master device and stacked device Grant 7,346,051 - Nakayama , et al. March 18, 2	2008-03-18
Circuit board with built-in electronic component and method for manufacturing the same Grant 7,341,890 - Ishimaru , et al. March 11, 2	2008-03-11
Circuit Board And Method For Manufacturing The Same App 20070124926 - Ishimaru; Yukihiro ; et al.	2007-06-07
Wiring board embedded with spherical semiconductor element App 20070069393 - Asahi; Toshiyuki ; et al.	2007-03-29
Circuit component built-in module and method for manufacturing the same Grant 7,180,169 - Ishimaru , et al. February 20, 2	2007-02-20
Electronic part, and electronic part mounting element and an process for manufacturing such the articles Grant 7,151,306 - Kitae , et al. December 19, 2	2006-12-19
Mount assembly, optical transmission line and photoelectric circuit board Grant 7,136,543 - Nishiyama , et al. November 14, 2	2006-11-14
Circuit board with built-in electronic component and method for manufacturing the same App 20060244119 - Ishimaru; Yukihiro ; et al.	2006-11-02
Circuit board with built-in electronic component and method for manufacturing the same Grant 7,091,593 - Ishimaru , et al. August 15, 2	2006-08-15
Slave device, master device and stacked device App 20050289269 - Nakayama, Takeshi ; et al.	2005-12-29
Circuit board and method for manufacturing the same App 20050199420 - Ishimaru, Yukihiro ; et al.	2005-09-15
Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same Grant 6,916,433 - Mitani , et al. July 12, 2	2005-07-12
Electronic part, and electronic part mounting element and an process for manufacturing such the articles App 20050098338 - Kitae, Takashi ; et al.	2005-05-12
Circuit component built-in module and method for manufacturing the same App 20050045369 - Ishimaru, Yukihiro ; et al.	2005-03-03
Electronic part, an electronic part mounting element and a process for manufacturing such the articles Grant 6,853,074 - Kitae , et al. February 8, 2	2005-02-08
Circuit board with in-built electronic component and method for manufacturing the same App 20050006142 - Ishimaru, Yukihiro ; et al.	2005-01-13
Mount assembly, optical transmission line and photoelectric circuit board App 20050002608 - Nishiyama, Tousaku ; et al.	2005-01-06
Conductive adhesive agent, packaging structure, and method for manufacturing the same structure Grant 6,814,893 - Takezawa , et al. November 9, 2	2004-11-09
Wiring board, method for manufacturing a wiring board and electronic equipment App 20040194999 - Tomita, Yoshihiro ; et al.	2004-10-07
Conductive adhesive and connection structure using the same Grant 6,749,774 - Takezawa , et al. June 15, 2	2004-06-15
Method of Manufacturing a multi-layer circuit board Grant 6,687,985 - Sakamoto , et al. February 10, 2	2004-02-10
Electronic component mounted member and repair method thereof Grant 6,675,474 - Mitani , et al. January 13, 2	2004-01-13
Conductive adhesive and packaging structure using the same Grant 6,666,994 - Takezawa , et al. December 23, 2	2003-12-23
Conductive adhesive agent, packaging structure, and method for manufacturing the same structure Grant 6,620,345 - Takezawa , et al. September 16, 2	2003-09-16
Conductive adhesive and connection structure using the same App 20030127632 - Takezawa, Hiroaki ; et al.	2003-07-10
Conductive adhesive and packaging structure using the same App 20030116756 - Takezawa, Hiroaki ; et al.	2003-06-26
Electronic component mounted member and repair method thereof App 20030079896 - Matani, Tsutomu ; et al.	2003-05-01
Conductive adhesive and connection structure using the same Grant 6,521,144 - Takezawa , et al. February 18, 2	2003-02-18
Electronic component mounted member and repair method thereof Grant 6,512,183 - Mitani , et al. January 28, 2	2003-01-28
Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module Grant 6,510,059 - Mitani , et al. January 21, 2	2003-01-21
Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module App 20020185306 - Mitani, Tsutomu ; et al.	2002-12-12
Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same App 20020158232 - Mitani, Tsutomu ; et al.	2002-10-31
Electronic component mounted member and repair method thereof App 20020062988 - Mitani, Tsutomu ; et al.	2002-05-30
Conductive adhesive agent, packaging structrue, and method for manufacturing the same structure App 20020050643 - Takezawa, Hiroaki ; et al.	2002-05-02
Conductive adhesive and packaging structure using the same App 20020043652 - Takezawa, Hiroaki ; et al.	2002-04-18
Multi-layer circuit board and method of manufacturing the same App 20020020554 - Sakamoto, Kazunori ; et al.	2002-02-21
Multi-layered circuit board and method of manufacturing the same Grant 6,281,446 - Sakamoto , et al. August 28, 2	2001-08-28
Conductive adhesive and connection structure using the same App 20010015424 - Takezawa, Hiroaki ; et al.	2001-08-23
Electronic part, an electronic part mounting element and an process for manufacturing such the articles App 20010005053 - Kitae, Takashi ; et al.	2001-06-28