Ishikura; Hidenori
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ishikura; Hidenori.The latest application filed is for "method of manufacturing metal-base substrate and method of manufacturing circuit board".
- Ishikura; Hidenori - Shibukawa N/A JP
- Ishikura; Hidenori - Shibukawa-city JP
- Ishikura; Hidenori - Gunma JP
| Patent | Date |
|---|---|
| Method of manufacturing metal-base substrate and method of manufacturing circuit board Grant 8,796,145 - Nishi , et al. August 5, 2 | 2014-08-05 |
| Method Of Manufacturing Metal-base Substrate And Method Of Manufacturing Circuit Board App 20130056439 - Nishi; Taiki ; et al. | 2013-03-07 |
| Metal-base circuit board and its manufacturing method Grant 7,709,939 - Yonemura , et al. May 4, 2 | 2010-05-04 |
| Resin Composition And Hybrid Integrated Circuit Board Making Use Of The Same App 20090133912 - Miyata; Kenji ; et al. | 2009-05-28 |
| Metal-base circuit board and its manufacturing method App 20070128772 - Yonemura; Naomi ; et al. | 2007-06-07 |
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