Ishikawa; Yohsuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishikawa; Yohsuke.The latest application filed is for "resin composition, prepreg, method for manufacturing prepreg, laminate, and printed wiring board".

Company Profile

4.4.7

Ishikawa; Yohsuke - Fukushima JP
ISHIKAWA; YOHSUKE - Mie JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing multilayer printed wiring board Grant 11,452,216 - Matsumura , et al. September 20, 2	2022-09-20
Resin Composition, Prepreg, Method For Manufacturing Prepreg, Laminate, And Printed Wiring Board App 20220259378 - SASAKI; Dai ; et al.	2022-08-18
Method For Manufacturing Multilayer Printed Wiring Board App 20210161020 - MATSUMURA; Kazuki ; et al.	2021-05-27
Resin-clad metal foil and flexible printed wiring board Grant 10,751,976 - Ishikawa , et al. A	2020-08-25
Resin Composition, Prepreg, Metal-clad Laminate, Printed Wiring Board, And Method For Fabricating The Metal-clad Laminate App 20200157300 - ISHIKAWA; Yohsuke ; et al.	2020-05-21
Resin-clad Metal Foil And Flexible Printed Wiring Board App 20190061320 - ISHIKAWA; Yohsuke ; et al.	2019-02-28
Double-sided Metal-clad Laminate Board And Method For Manufacturing Same App 20180141311 - OZEKI; TAKAYOSHI ; et al.	2018-05-24
Flexible printed wiring board and laminate for production of flexible printed wiring board Grant 9,232,636 - Ozeki , et al. January 5, 2	2016-01-05
Flexible Printed Wiring Board And Laminate For Production Of Flexible Printed Wiring Board App 20130256002 - Ozeki; Takayoshi ; et al.	2013-10-03

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