Ishikawa; Tetsuji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishikawa; Tetsuji.The latest application filed is for "power-demand-value calculating system, power-demand-value calculating method, and recording medium recording power-demand-value calculating program".

Company Profile

0.8.14

Ishikawa; Tetsuji - Kawasaki JP
Ishikawa; Tetsuji - Kanuma JP
Ishikawa; Tetsuji - Hoofdorp NL
Ishikawa, Tetsuji - Tochigi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power-demand-value calculating system, power-demand-value calculating method, and recording medium recording power-demand-value calculating program Grant 10,989,743 - Kitajima , et al. April 27, 2	2021-04-27
Power-demand-value Calculating System, Power-demand-value Calculating Method, And Recording Medium Recording Power-demand-value Calculating Program App 20180321288 - Kitajima; Masayuki ; et al.	2018-11-08
Ordering Program, Ordering Device, And Ordering Method App 20170032448 - Kitajima; Masayuki ; et al.	2017-02-02
Joining method and reflow apparatus Grant 8,434,658 - Ishikawa May 7, 2	2013-05-07
Joining Method And Reflow Apparatus App 20110192536 - ISHIKAWA; Tetsuji	2011-08-11
Joining method and reflow apparatus Grant 7,975,898 - Ishikawa July 12, 2	2011-07-12
Joining Method And Reflow Apparatus App 20100170939 - ISHIKAWA; Tetsuji	2010-07-08
Heating apparatus Grant 7,661,573 - Saito , et al. February 16, 2	2010-02-16
Method and apparatus for rework soldering App 20090289100 - Ishikawa; Tetsuji ; et al.	2009-11-26
Soldering Method And Apparatus For Mounting Devices On Printed Circuit Board App 20090084831 - Ishikawa; Tetsuji ; et al.	2009-04-02
Method for manufacturing product involving solder joining, solder joining apparatus, soldering condition verification method, reflow apparatus, and solder joining method App 20090020588 - Saito; Osamu ; et al.	2009-01-22
Method of removing integrated circuit chip package and detachment jig therefor Grant 7,469,457 - Ishikawa , et al. December 30, 2	2008-12-30
Printed circuit board unit and printed wiring board App 20080225500 - Kuroda; Yasuhide ; et al.	2008-09-18
Paste Printer And Method Of Printing With Paste App 20080145972 - ISHIKAWA; Tetsuji ; et al.	2008-06-19
Heating apparatus App 20060273141 - Saito; Osamu ; et al.	2006-12-07
Method of removing integrated circuit chip package and detachment jig therefor App 20060107513 - Ishikawa; Tetsuji ; et al.	2006-05-25
Bobbin for heat transfer printing film Grant D515,128 - Ishikawa , et al. February 14, 2	2006-02-14
Roll, roll production apparatus and method for producing roll Grant 6,972,066 - Ishikawa , et al. December 6, 2	2005-12-06
Roll, roll production apparatus and method for producing roll App 20050155701 - Ishikawa, Tetsuji ; et al.	2005-07-21
Roll production apparatus App 20050139098 - Ishikawa, Tetsuji ; et al.	2005-06-30
Roll, roll production apparatus and method for producing roll App 20010053430 - Ishikawa, Tetsuji ; et al.	2001-12-20

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