loadpatents
name:-0.019946098327637
name:-0.012901067733765
name:-0.00055909156799316
ISHIKAWA; Shigeharu Patent Filings

ISHIKAWA; Shigeharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for ISHIKAWA; Shigeharu.The latest application filed is for "method for producing honeycomb dried body and method for manufacturing honeycomb structured body".

Company Profile
0.11.17
  • ISHIKAWA; Shigeharu - Ibi-gun JP
  • Ishikawa; Shigeharu - Tokyo JP
  • Ishikawa; Shigeharu - Gifu JP
  • Ishikawa; Shigeharu - Gifu-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Producing Honeycomb Dried Body And Method For Manufacturing Honeycomb Structured Body
App 20150210601 - MAKINO; Hayato ;   et al.
2015-07-30
Method For Producing Honeycomb Dried Body And Method For Manufacturing Honeycomb Structured Body
App 20150210029 - MAKINO; Hayato ;   et al.
2015-07-30
Method For Cutting Honeycomb Dried Body, Method For Manufacturing Honeycomb Structured Body, Honeycomb Dried Body, And Honeycomb Structured Body
App 20150209934 - MAKINO; Hayato ;   et al.
2015-07-30
Method Of Producing Honeycomb Structured Body, And Die For Extrusion Molding
App 20150008625 - SATO; Masaya ;   et al.
2015-01-08
Image Correction Data Generating System, Image Correction Data Generating Method, And Image Correction Data Generating Program For Display Panel Using Unpolished Glass
App 20130155042 - Ishikawa; Shigeharu ;   et al.
2013-06-20
Honeycomb Structure
App 20120251767 - Ishikawa; Shigeharu ;   et al.
2012-10-04
Honeycomb structure
Grant 8,172,921 - Ohno , et al. May 8, 2
2012-05-08
Particulate filter for diesel engine
Grant D647,607 - Ohno , et al. October 25, 2
2011-10-25
Honeycomb structure and method for manufacturing honeycomb structure
Grant 7,862,781 - Ohno , et al. January 4, 2
2011-01-04
Method for manufacturing honeycomb structure and extrusion-molding method for forming coupled honeycomb molded body
Grant 7,862,672 - Ohno , et al. January 4, 2
2011-01-04
Particulate filter for diesel engine
Grant D609,320 - Ohno , et al. February 2, 2
2010-02-02
Vacuum chuck and suction board
Grant 7,654,887 - Ishikawa , et al. February 2, 2
2010-02-02
Particulate filter for diesel engine
Grant D609,319 - Ohno , et al. February 2, 2
2010-02-02
Honeycomb Structure
App 20090239028 - OHNO; Kazushige ;   et al.
2009-09-24
Honeycomb Structure
App 20090239740 - Ohno; Kazushige ;   et al.
2009-09-24
Honeycomb Structure And Method For Manufacturing Honeycomb Structure
App 20080236394 - OHNO; Kazushige ;   et al.
2008-10-02
Method For Manufacturing Honeycomb Structure Extrusion-molding Method For Forming Coupled Honeycomb Molded Body And Die For Extrusion-molding Method
App 20080203626 - Ohno; Kazushige ;   et al.
2008-08-28
Honeycomb Structure
App 20080202087 - Ohno; Kazushige ;   et al.
2008-08-28
Vacuum chuck and suction board
App 20070063453 - Ishikawa; Shigeharu ;   et al.
2007-03-22
Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
Grant 7,040,963 - Okuda , et al. May 9, 2
2006-05-09
Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
Grant 7,029,379 - Jimbo , et al. April 18, 2
2006-04-18
Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
App 20050260938 - Okuda, Yuji ;   et al.
2005-11-24
Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer
App 20050260930 - Okuda, Yuji ;   et al.
2005-11-24
Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
App 20050245177 - Jimbo, Naoyuki ;   et al.
2005-11-03
Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
Grant 6,916,228 - Jimbo , et al. July 12, 2
2005-07-12
Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
App 20030008598 - Jimbo, Naoyuki ;   et al.
2003-01-09
Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
Grant 6,475,068 - Jimbo , et al. November 5, 2
2002-11-05

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