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name:-0.0036890506744385
name:-0.0014078617095947
name:-0.0003812313079834
Ishikawa; Sachiko Patent Filings

Ishikawa; Sachiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishikawa; Sachiko.The latest application filed is for "liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components".

Company Profile
0.2.3
  • Ishikawa; Sachiko - Kamakura JP
  • Ishikawa; Sachiko - Hiroshima-city JP
  • Ishikawa; Sachiko - Braunschweig DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Deployment method and system
Grant 7,930,371 - Furuyama , et al. April 19, 2
2011-04-19
Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components
App 20090283013 - Takahagi; Takayuki ;   et al.
2009-11-19
Deployment Method And System
App 20090132683 - FURUYAMA; Yusuke ;   et al.
2009-05-21
Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components
App 20070107317 - Takahagi; Takayuki ;   et al.
2007-05-17
Optical pickup using a waveguide
Grant 4,861,128 - Ishikawa , et al. August 29, 1
1989-08-29

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