Ishii; Shigeyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishii; Shigeyoshi.The latest application filed is for "laminate film for attaching to a window, and a manufacturing method thereof and an applying method thereof".

Company Profile

0.4.10

Ishii; Shigeyoshi - Hatiouji-city JP
Ishii; Shigeyoshi - Hachiouji-city JP
Ishii; Shigeyoshi - Sagamihara JP
ISHII; Shigeyoshi - Sagamihara-city JP
Ishii; Shigeyoshi - Kanagawa JP
Ishii; Shigeyoshi - Hatiouji JP
Ishii, Shigeyoshi - Tokyo JP
Ishii, Shigeyoshi - Kanagawa pref JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laminate Film For Attaching To A Window, And A Manufacturing Method Thereof And An Applying Method Thereof App 20140370308 - Ishii; Shigeyoshi	2014-12-18
Laminate Window Film Having Micro Through Holes App 20140120309 - Ishii; Shigeyoshi	2014-05-01
Adhesive sheet for light-emitting diode device and light-emitting diode device Grant 7,973,403 - Itoh , et al. July 5, 2	2011-07-05
Adhesive Sheet For Light-emitting Diode Device And Light-emitting Diode Device App 20100065878 - ITOH; Koji ; et al.	2010-03-18
Adhesive sheet for light-emitting diode device and light-emitting diode device Grant 7,646,088 - Itoh , et al. January 12, 2	2010-01-12
Adhesive Sheet for Light-Emitting Diode Device and Light-Emitting Diode Device App 20080237617 - Itoh; Koji ; et al.	2008-10-02
Heat-curable adhesive composition Grant 7,358,289 - Toriumi , et al. April 15, 2	2008-04-15
Heat-curable adhesive composition App 20060014871 - Toriumi; Naoyuki ; et al.	2006-01-19
Thermosetting adhesive sheet with electroconductive and thermoconductive properties App 20050233161 - Takeda, Masaaki ; et al.	2005-10-20
Film adhesive for sealing, film laminate for sealing and sealing method App 20040213973 - Hara, Tomihiro ; et al.	2004-10-28
Thermosetting adhesive film, and an adhesive structure based on the use thereof App 20040068061 - Kawate, Kohichiro ; et al.	2004-04-08
Thermosetting adhesive App 20040063804 - Takeda, Masaaki ; et al.	2004-04-01
Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive Grant 6,051,652 - Kawate , et al. April 18, 2	2000-04-18

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