Ishii; Ikuko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishii; Ikuko.The latest application filed is for "device package with hermetically sealed cap and device encapsulation method".

Company Profile

0.6.6

Ishii; Ikuko - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device package with a thermoplastic encapsulation cap and device encapsulation method Grant 7,224,119 - Ishii , et al. May 29, 2	2007-05-29
Device package with hermetically sealed cap and device encapsulation method Grant 6,929,523 - Ishii , et al. August 16, 2	2005-08-16
Device package with hermetically sealed cap and device encapsulation method App 20050057155 - Ishii, Ikuko ; et al.	2005-03-17
Device package with hermetically sealed cap Grant 6,828,728 - Ishii , et al. December 7, 2	2004-12-07
Organic EL panel and filter for same Grant 6,706,425 - Ishii , et al. March 16, 2	2004-03-16
Organic EL element and method of manufacturing the same Grant 6,677,620 - Ishii , et al. January 13, 2	2004-01-13
Organic EL panel and filter for same App 20030203235 - Ishii, Ikuko ; et al.	2003-10-30
Organic electro-luminescent display panel and method for manufacturing same App 20030186018 - Ishii, Ikuko ; et al.	2003-10-02
Device package and device encapsulation method App 20030080679 - Ishii, Ikuko ; et al.	2003-05-01
Organic electro-luminescent display panel Grant 6,551,724 - Ishii , et al. April 22, 2	2003-04-22
Organic EL element and method of manufacturing the same App 20020000560 - Ishii, Ikuko ; et al.	2002-01-03
Organic electro-luminescent display panel and method for manufacturing same App 20010046579 - Ishii, Ikuko ; et al.	2001-11-29

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