| Patent | Date |
|---|
Semiconductor device and process for fabricating the same
Grant 11,127,657 - Ishihara September 21, 2 | 2021-09-21 |
Chip-size, double side connection package and method for manufacturing the same
Grant 10,748,840 - Ishihara A | 2020-08-18 |
Semiconductor Device And Process For Fabricating The Same
App 20200161223 - Ishihara; Masamichi | 2020-05-21 |
Semiconductor device and process for fabricating the same
Grant 10,559,521 - Ishihara Feb | 2020-02-11 |
Semiconductor Device And Process For Fabricating The Same
App 20190122961 - Ishihara; Masamichi | 2019-04-25 |
Semiconductor device and process for fabricating the same
Grant 10,199,310 - Ishihara Fe | 2019-02-05 |
Chip-size, Double Side Connection Package And Method For Manufacturing The Same
App 20180269141 - Ishihara; Masamichi | 2018-09-20 |
Chip-size, double side connection package and method for manufacturing the same
Grant 9,984,961 - Ishihara May 29, 2 | 2018-05-29 |
Semiconductor Device And Process For Fabricating The Same
App 20180122722 - Ishihara; Masamichi | 2018-05-03 |
Semiconductor device and process for fabricating the same
Grant 9,887,147 - Ishihara February 6, 2 | 2018-02-06 |
Semiconductor device and fabrication method for same
Grant 9,812,621 - Ishihara , et al. November 7, 2 | 2017-11-07 |
LED illumination module and LED illumination apparatus
Grant 9,698,327 - Ishihara , et al. July 4, 2 | 2017-07-04 |
Chip-size, double side connection package and method for manufacturing the same
App 20170162491 - Ishihara; Masamichi | 2017-06-08 |
Semiconductor Device And Process For Fabricating The Same
App 20170103938 - Ishihara; Masamichi | 2017-04-13 |
Semiconductor device and process for fabricating the same
Grant 9,559,041 - Ishihara January 31, 2 | 2017-01-31 |
Stacked semiconductor device and fabrication method for same
Grant 9,252,125 - Kagaya , et al. February 2, 2 | 2016-02-02 |
Semiconductor Device And Process For Fabricating The Same
App 20150287663 - Ishihara; Masamichi | 2015-10-08 |
Semiconductor device and process for fabricating the same
Grant 9,093,431 - Ishihara July 28, 2 | 2015-07-28 |
Led Illumination Module And Led Illumination Apparatus
App 20150155459 - Ishihara; Masamichi ; et al. | 2015-06-04 |
Heat sink package and method of manufacturing
Grant 8,988,882 - Ohsawa , et al. March 24, 2 | 2015-03-24 |
Interconnect-use electronic component and method for producing same
Grant 8,952,261 - Ishihara , et al. February 10, 2 | 2015-02-10 |
Semiconductor Device And Fabrication Method For Same
App 20140327024 - Ishihara; Masamichi ; et al. | 2014-11-06 |
Semiconductor Device And Process For Fabricating The Same
App 20140131891 - Ishihara; Masamichi | 2014-05-15 |
Chip-size, double side connection package and method for manufacturing the same
App 20140091459 - Ishihara; Masamichi | 2014-04-03 |
Semiconductor device and process for fabricating the same
Grant 8,664,666 - Ishihara March 4, 2 | 2014-03-04 |
Method for manufacturing a chip-size double side connection package
Grant 8,557,700 - Ishihara October 15, 2 | 2013-10-15 |
Double-faced electrode package, and its manufacturing method
Grant 8,501,542 - Ishihara , et al. August 6, 2 | 2013-08-06 |
Three-dimensionally integrated semicondutor device and method for manufacturing the same
Grant 8,415,789 - Ishihara April 9, 2 | 2013-04-09 |
Electronic component used for wiring and method for manufacturing the same
Grant 8,399,980 - Ishihara , et al. March 19, 2 | 2013-03-19 |
Stacked Semiconductor Device And Fabrication Method For Same
App 20130001755 - KAGAYA; Yutaka ; et al. | 2013-01-03 |
Interconnect-use Electronic Component And Method For Producing Same
App 20120261169 - Ishihara; Masamichi ; et al. | 2012-10-18 |
Stacked semiconductor device and fabrication method for same
Grant 8,247,896 - Kagaya , et al. August 21, 2 | 2012-08-21 |
Double-faced Electrode Package, And Its Manufacturing Method
App 20120164790 - Ishihara; Masamichi ; et al. | 2012-06-28 |
Heat Sink Package And Method Of Manufacturing
App 20120127667 - Ohsawa; Kenji ; et al. | 2012-05-24 |
Double-faced electrode package and its manufacturing method
Grant 8,154,110 - Ishihara , et al. April 10, 2 | 2012-04-10 |
Semiconductor chip package with post electrodes
Grant 8,110,911 - Ishihara , et al. February 7, 2 | 2012-02-07 |
Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method
Grant 8,017,452 - Ishihara , et al. September 13, 2 | 2011-09-13 |
Semiconductor Device And Process For Fabricating The Same
App 20110201178 - Ishihara; Masamichi | 2011-08-18 |
Semiconductor device and process for fabricating the same
Grant 7,944,058 - Ishihara May 17, 2 | 2011-05-17 |
Semiconductor Device With Double-sided Electrode Structure And Its Manufacturing Method
App 20110089551 - ISHIHARA; Masamichi ; et al. | 2011-04-21 |
Three-dimensionally Integrated Semicondutor Device And Method For Manufacturing The Same
App 20110062584 - Ishihara; Masamichi | 2011-03-17 |
Chip-size Double Side Connection Package And Method For Manufacturing The Same
App 20110057325 - Ishihara; Masamichi | 2011-03-10 |
Semiconductor device with double-sided electrode structure and its manufacturing method
Grant 7,884,466 - Ishihara , et al. February 8, 2 | 2011-02-08 |
Electronic Component Used For Wiring And Method For Manufacturing The Same
App 20110012269 - Ishihara; Masamichi ; et al. | 2011-01-20 |
Stacked Semiconductor Device And Fabrication Method For Same
App 20110001235 - KAGAYA; Yutaka ; et al. | 2011-01-06 |
Semiconductor Chip Package And Manufacturing Method Thereof
App 20100295178 - Ishihara; Masamichi ; et al. | 2010-11-25 |
Packaged semiconductor device and method of manufacturing the packaged semiconductor device
Grant 7,838,983 - Ishihara November 23, 2 | 2010-11-23 |
Method for processing copper surface, method for forming copper pattern wiring and semiconductor device manufactured using such method
Grant 7,825,026 - Izumi , et al. November 2, 2 | 2010-11-02 |
Stacked semiconductor device
Grant 7,808,093 - Kagaya , et al. October 5, 2 | 2010-10-05 |
Double-faced Electrode Package And Its Manufacturing Method
App 20090224381 - Ishihara; Masamichi ; et al. | 2009-09-10 |
Packaged stacked semiconductor device and method for manufacturing the same
Grant 7,576,413 - Ishihara , et al. August 18, 2 | 2009-08-18 |
Packaged Semiconductor Device And Method Of Manufacturing The Same
App 20090140364 - Ishihara; Masamichi | 2009-06-04 |
Semiconductor Device With Double-sided Electrode Structure And Its Manufacturing Method
App 20090072381 - Ishihara; Masamichi ; et al. | 2009-03-19 |
Method Of Manufacturing Semiconductor Device With Electrode For External Connection And Semiconductor Device Obtained By Means Of Said Method
App 20090050994 - ISHIHARA; Masamichi ; et al. | 2009-02-26 |
Semiconductor Device an Process for Fabricating the Same
App 20080265430 - Ishihara; Masamichi | 2008-10-30 |
Semiconductor Device Having Music Generation Function, and Mobile Electronic Device, Mobile Telephone Device, Spectacle Instrument, and Spectacle instrument Set Using the Same
App 20080223196 - Nakamura; Shunsuke ; et al. | 2008-09-18 |
Packaged Stacked Semiconductor Device And Method For Manufacturing The Same
App 20080061402 - Ishihara; Masamichi ; et al. | 2008-03-13 |
Stacked Semiconductor Device And Fabrication Method For Same
App 20070241437 - Kagaya; Yutaka ; et al. | 2007-10-18 |
Sealed stacked arrangement of semiconductor devices
Grant RE37,539 - Oguchi , et al. February 5, 2 | 2002-02-05 |
Dynamic type semiconductor memory device
Grant 6,108,264 - Takahashi , et al. August 22, 2 | 2000-08-22 |
Semiconductor integrated circuit device, and process and apparatus for manufacturing the same
Grant 5,910,010 - Nishizawa , et al. June 8, 1 | 1999-06-08 |
Semiconductor memory having both a refresh operation cycle and a normal operation cycle and employing an address non-multiplex system
Grant 5,862,095 - Takahashi , et al. January 19, 1 | 1999-01-19 |
Semiconductor memory device with improved substrate arrangement to permit forming a plurality of different types of random access memory, and a testing method therefor
Grant 5,805,513 - Takahashi , et al. September 8, 1 | 1998-09-08 |
Semiconductor memory having a refresh operation cycle and operating at a high speed and reduced power consumption in a normal operation cycle
Grant 5,719,815 - Takahashi , et al. February 17, 1 | 1998-02-17 |
Semiconductor device
Grant 5,714,405 - Tsubosaki , et al. February 3, 1 | 1998-02-03 |
Corona control ring having elongated water discharge holes
Grant 5,705,775 - Ishihara , et al. January 6, 1 | 1998-01-06 |
Sealed stacked arrangement of semiconductor devices
Grant 5,701,031 - Oguchi , et al. December 23, 1 | 1997-12-23 |
Method of fabrication of semiconductor integrated circuit device
Grant 5,610,089 - Iwai , et al. March 11, 1 | 1997-03-11 |
Semiconductor device with lead structure within the planar area of the device
Grant 5,583,375 - Tsubosaki , et al. December 10, 1 | 1996-12-10 |
Semiconductor integrated circuit device having output and internal circuit MISFETS
Grant 5,534,723 - Iwai , et al. July 9, 1 | 1996-07-09 |
Semiconductor memory device with improved substrate arrangement to permit forming a plurality of different types of random access memory, and a testing method therefor
Grant 5,426,613 - Takahashi , et al. June 20, 1 | 1995-06-20 |
Special mode control method for dynamic random access memory
Grant 5,410,507 - Tazunoki , et al. April 25, 1 | 1995-04-25 |
Multi-chip semiconductor package
Grant 5,332,922 - Oguchi , et al. July 26, 1 | 1994-07-26 |
Semiconductor integrated circuit device having protective/output elements and internal circuits
Grant 5,276,346 - Iwai , et al. January 4, 1 | 1994-01-04 |
Semiconductor integrated circuit device having a plurality of memory blocks and a lead on chip (LOC) arrangement
Grant 5,208,782 - Sakuta , et al. May 4, 1 | 1993-05-04 |
Semiconductor memory device with low-house pads for electron beam test
Grant 5,021,998 - Suzuki , et al. June 4, 1 | 1991-06-04 |
Memory including address registers for increasing access speed to the memory
Grant 5,018,109 - Shinoda , et al. May 21, 1 | 1991-05-21 |
Semiconductor memory device
Grant 4,991,139 - Takahashi , et al. February 5, 1 | 1991-02-05 |
Resin-encapsulated semiconductor device
Grant 4,951,122 - Tsubosaki , et al. August 21, 1 | 1990-08-21 |
Semiconductor memory
Grant 4,928,281 - Kurosawa , et al. May 22, 1 | 1990-05-22 |
Memory including address registers
Grant 4,912,679 - Shinoda , et al. March 27, 1 | 1990-03-27 |
Dual port semiconductor memory having random and serial access modes
Grant 4,858,190 - Yamaguchi , et al. August 15, 1 | 1989-08-15 |
Semiconductor memory
Grant 4,819,213 - Yamaguchi , et al. April 4, 1 | 1989-04-04 |
Semiconductor memory having multiple continuous access functions
Grant 4,802,135 - Shinoda , et al. January 31, 1 | 1989-01-31 |
Semiconductor memory device
Grant 4,562,555 - Ouchi , et al. December 31, 1 | 1985-12-31 |
Memory array with larger memory capacitors at row ends
Grant 4,118,794 - Mizuno , et al. October 3, 1 | 1978-10-03 |
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