ISHIHARA CHEMICAL CO., LTD.
Patent Applications and Registrations
Patent applications and USPTO patent grants for ISHIHARA CHEMICAL CO., LTD..The latest application filed is for "copper or copper alloy electroplating bath".
- ISHIHARA CHEMICAL CO., LTD. - Kobe-shi, Hyogo JP
- ISHIHARA CHEMICAL CO., LTD. - Kobe JP
- ISHIHARA CHEMICAL CO., LTD. - Hyogo JP
- Ishihara Chemical Co., Ltd. - Austin TX
- ISHIHARA CHEMICAL CO., LTD. - Hyogo-ku, Hyogo N/A JP
- ISHIHARA CHEMICAL CO., LTD. - Hyogo-ku TX JP
- ISHIHARA CHEMICAL CO, LTD - Hyogo JP
- Ishihara Chemical Co., Ltd. - Kobe-shi JP
Trademarks
| Patent | Date |
|---|---|
| Copper Or Copper Alloy Electroplating Bath App 20220127741 - HATABE; Masaru ; et al. | 2022-04-28 |
| Structure containing Sn layer or Sn alloy layer Grant 11,052,637 - Iuchi , et al. July 6, 2 | 2021-07-06 |
| Structure Containing Sn Layer Or Sn Alloy Layer App 20200376808 - IUCHI; Shoya ; et al. | 2020-12-03 |
| Electrolytic Tin Or Tin Alloy Plating Bath And Electronic Component Having Electrodeposition Article That Is Formed With Use Of App 20190368063 - YAMAGUCHI; Syohei ; et al. | 2019-12-05 |
| Ta--Nb alloy powder and anode element for solid electrolytic capacitor Grant 10,329,644 - Maeshima , et al. | 2019-06-25 |
| Metallic ink Grant 10,231,344 - Li , et al. | 2019-03-12 |
| Method for manufacturing alloy bump Grant 10,062,657 - Iuchi , et al. August 28, 2 | 2018-08-28 |
| Conductive film forming method and sintering promoter Grant 9,905,339 - Kawato , et al. February 27, 2 | 2018-02-27 |
| Method For Manufacturing Alloy Bump App 20170330850 - IUCHI; Shoya ; et al. | 2017-11-16 |
| Ta-Nb ALLOY POWDER AND ANODE ELEMENT FOR SOLID ELECTROLYTIC CAPACITOR App 20170283916 - MAESHIMA; Takayuki ; et al. | 2017-10-05 |
| Photo-curing process for metallic inks Grant 9,730,333 - Li , et al. August 8, 2 | 2017-08-08 |
| Copper particulate dispersion, conductive film forming method and circuit board Grant 9,615,455 - Kawato , et al. April 4, 2 | 2017-04-04 |
| Ta Powder, Production Method Therefor, And Ta Granulated Powder App 20160104580 - MAESHIMA; Takayuki ; et al. | 2016-04-14 |
| Copper Particulate Dispersion, Conductive Film Forming Method, And Circuit Board App 20160029483 - KAWATO; Yuichi ; et al. | 2016-01-28 |
| Copper Particulate Dispersion, Conductive Film Forming Method, And Circuit Board App 20160007455 - KAWATO; Yuichi ; et al. | 2016-01-07 |
| Buffer layer for sintering Grant 9,131,610 - Yaniv , et al. September 8, 2 | 2015-09-08 |
| Copper particulate dispersion, conductive film forming method and circuit board Grant 9,120,944 - Kawato , et al. September 1, 2 | 2015-09-01 |
| Conductive Film Forming Method And Sintering Promoter App 20150118413 - Kawato; Yuichi ; et al. | 2015-04-30 |
| Conductive Film Forming Method And Sintering Promoter App 20150030784 - Kawato; Yuichi ; et al. | 2015-01-29 |
| Circuit Board, Conductive Film Forming Method And Adhesiveness Improver App 20150021071 - Kawato; Yuichi ; et al. | 2015-01-22 |
| Buffer Layer For Sintering App 20140057428 - Yaniv; Zvi ; et al. | 2014-02-27 |
| Buffer layer to enhance photo and/or laser sintering Grant 8,647,979 - Yaniv , et al. February 11, 2 | 2014-02-11 |
| Additives and modifiers for solvent- and water-based metallic conductive inks Grant 8,506,849 - Li , et al. August 13, 2 | 2013-08-13 |
| Metallic ink Grant 8,404,160 - Li , et al. March 26, 2 | 2013-03-26 |
| Silver and silver alloy plating bath Grant 7,938,948 - Tsuji , et al. May 10, 2 | 2011-05-10 |
| Production method of pure metal/alloy super-micro powder Grant 7,799,112 - Yonehana , et al. September 21, 2 | 2010-09-21 |
| Silver And Silver Alloy Plating Bath App 20090321269 - TSUJI; Kiyotaka ; et al. | 2009-12-31 |
| Silver and silver alloy plating bath Grant 7,628,903 - Tsuji , et al. December 8, 2 | 2009-12-08 |
| Metallic Ink App 20090274833 - Li; Yunjun ; et al. | 2009-11-05 |
| Production method of pure metal/alloy super-micro powder App 20090139372 - Yonehana; Yasunori ; et al. | 2009-06-04 |
| Colored, transparent film-forming composition, its coating method and removing method of a film thereof Grant 6,730,240 - Arimoto , et al. May 4, 2 | 2004-05-04 |
| Plating bath and process for depositing alloy containing tin and copper Grant 6,607,653 - Tsuji , et al. August 19, 2 | 2003-08-19 |
| Non-cyanide-type gold-tin alloy plating bath App 20020063063 - Uchida, Ei ; et al. | 2002-05-30 |
| Palladium-base electroless plating solution Grant 4,804,410 - Haga , et al. February 14, 1 | 1989-02-14 |
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