Ishigami; Hideki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishigami; Hideki.The latest application filed is for "package base, package, electronic device, electronic apparatus, and moving object".

Company Profile

1.7.13

Ishigami; Hideki - Hachinohe JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object Grant 9,954,160 - Ishigami , et al. April 24, 2	2018-04-24
Package base, package, electronic device, electronic apparatus, and moving object Grant 9,769,934 - Miyao , et al. September 19, 2	2017-09-19
Package Base, Package, Electronic Device, Electronic Apparatus, And Moving Object App 20160021752 - MIYAO; Tetsuro ; et al.	2016-01-21
Method of manufacturing electric wiring layer, member for forming electric wiring layer, electric wiring layer, method of manufacturing electric wiring board, member for forming electric wiring board, electric wiring board, vibrator, electronic apparatus, and moving object Grant 9,219,218 - Ishigami , et al. December 22, 2	2015-12-22
Wiring Board, Method Of Manufacturing Wiring Board, Electronic Device, Electronic Apparatus, And Moving Object App 20150223325 - MIYAO; Tetsuro ; et al.	2015-08-06
Dental Component, Metal Powder For Powder Metallurgy, And Method For Producing Dental Component App 20150216637 - NARUMI; Isshin ; et al.	2015-08-06
Manufacturing Method Of Compact, Manufacturing Method Of Structure, And Cutting Processed Material App 20150217371 - NARUMI; Isshin ; et al.	2015-08-06
Method for producing sintered compact Grant 9,073,121 - Nakamura , et al. July 7, 2	2015-07-07
Method Of Manufacturing Electric Wiring Layer, Member For Forming Electric Wiring Layer, Electric Wiring Layer, Method Of Manufacturing Electric Wiring Board, Member For Forming Electric Wiring Board, Electric Wiring Board, Vibrator, Electronic Apparatus, And Moving Object App 20150188024 - ISHIGAMI; Hideki ; et al.	2015-07-02
Wiring Board, Method Of Manufacturing The Same, Element Housing Package, Electronic Device, Electronic Apparatus, And Moving Object App 20150130326 - ISHIGAMI; Hideki ; et al.	2015-05-14
Metal Powder For Powder Metallurgy, Compound, Granulated Powder, And Sintered Body App 20150114178 - ISHIGAMI; Hideki ; et al.	2015-04-30
Circuit Board, Method For Manufacturing Circuit Board, Electronic Device, Electronic Apparatus, And Moving Object App 20150070855 - MIYAO; Tetsuro ; et al.	2015-03-12
Translucent Alumina And Method For Producing Translucent Alumina App 20130256957 - ISHIGAMI; Hideki ; et al.	2013-10-03
Method of manufacturing translucent ceramic and orthodontic member Grant 8,420,006 - Sakata , et al. April 16, 2	2013-04-16
Polishing Media, Method For Producing Polishing Media, And Polishing Method App 20120252322 - ISHIGAMI; Hideki ; et al.	2012-10-04
Binder Composition For Powder Metallurgy, Compound For Powder Metallurgy, And Sintered Body App 20110314964 - ISHIGAMI; Hideki ; et al.	2011-12-29
Method For Producing Sintered Compact App 20110280759 - NAKAMURA; Hidefumi ; et al.	2011-11-17
Method Of Manufacturing Translucent Ceramic And Orthodontic Member App 20090224442 - SAKATA; Masaaki ; et al.	2009-09-10

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