loadpatents
name:-0.021845817565918
name:-0.014123916625977
name:-0.00053095817565918
Ishigami; Akira Patent Filings

Ishigami; Akira

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishigami; Akira.The latest application filed is for "anisotropic conductive adhesive".

Company Profile
0.14.22
  • Ishigami; Akira - Tochigi JP
  • Ishigami; Akira - Shinagawa-ku JP
  • ISHIGAMI; Akira - Kanuma-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Adhesive agent and connection structure
Grant 10,435,601 - Aoki , et al. O
2019-10-08
Adhesive and light-emitting device
Grant 9,994,743 - Aoki , et al. June 12, 2
2018-06-12
Anisotropic conductive adhesive
Grant 9,676,066 - Ishigami , et al. June 13, 2
2017-06-13
Anisotropic conductive adhesive
Grant 9,670,385 - Namiki , et al. June 6, 2
2017-06-06
Anisotropic Conductive Adhesive
App 20170121571 - NAMIKI; Hidetsugu ;   et al.
2017-05-04
Adhesive Agent And Connection Structure
App 20170114255 - AOKI; Masaharu ;   et al.
2017-04-27
Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesive
Grant 9,487,678 - Namiki , et al. November 8, 2
2016-11-08
Light-emitting Device, Anisotropic Conductive Paste, And Method Of Manufacturing Light-emitting Device
App 20160204313 - NAMIKI; Hidetsugu ;   et al.
2016-07-14
Adhesive And Light-emitting Device
App 20160194531 - AOKI; Masaharu ;   et al.
2016-07-07
Light-reflective anisotropic conductive adhesive agent, and light emitting device
Grant 9,260,634 - Namiki , et al. February 16, 2
2016-02-16
Anisotropic Conductive Adhesive, Light Emitting Device, And Method For Producing Anisotropic Conductive Adhesive
App 20150353781 - NAMIKI; Hidetsugu ;   et al.
2015-12-10
Anisotropic Conductive Adhesive
App 20150209914 - Ishigami; Akira ;   et al.
2015-07-30
Anisotropic Conductive Adhesive And Connection Structure
App 20150197672 - Namiki; Hidetsugu ;   et al.
2015-07-16
Light-reflective Anisotropic Conductive Adhesive Agent, And Light Emitting Device
App 20150069448 - Namiki; Hidetsugu ;   et al.
2015-03-12
Anisotropic Conductive Adhesive And Method For Manufacturing Same, Light-emitting Device And Method For Manufacturing Same
App 20150034989 - NAMIKI; Hidetsugu ;   et al.
2015-02-05
Light-reflective anisotropic conductive adhesive agent, and light emitting device
Grant 8,916,894 - Namiki , et al. December 23, 2
2014-12-23
Light-reflective anisotropic conductive adhesive and light-emitting device
Grant 8,852,462 - Umakoshi , et al. October 7, 2
2014-10-07
Buffer Film For Multi-chip Packaging
App 20140248477 - ISHIGAMI; Akira ;   et al.
2014-09-04
Anisotropic Conductive Adhesive And Method For Manufacturing Same, And Light-emitting Device And Method For Manufacturing Same
App 20140217450 - ISHIGAMI; Akira ;   et al.
2014-08-07
Buffer film for multi-chip packaging
Grant 8,758,546 - Ishigami , et al. June 24, 2
2014-06-24
Light-reflective anisotropic conductive paste and light-emitting device
Grant 8,710,662 - Umakoshi , et al. April 29, 2
2014-04-29
Light-reflective Anisotropic Conductive Adhesive And Light-emitting Device
App 20130264602 - Namiki; Hidetsugu ;   et al.
2013-10-10
Buffer Film For Multi-chip Packaging
App 20130092310 - Ishigami; Akira ;   et al.
2013-04-18
Light-reflective Anisotropic Conductive Adhesive And Light Emitting Device
App 20130087825 - Umakoshi; Hideaki ;   et al.
2013-04-11
Curable Resin Composition, Adhesive Epoxy Resin Paste, Die-bonding Agent, Non-conductive Paste, Adhesive Epoxy Resin Film, Non-conductive Epoxy Resin Film, Anisotropic Conductive Paste, And Anisotropic Conductive Film
App 20130056686 - Namiki; Hidetsugu ;   et al.
2013-03-07
Light-reflective Anisotropic Conductive Adhesive Agent, And Light Emitting Device
App 20130049054 - Namiki; Hidetsugu ;   et al.
2013-02-28
Light-reflective Anisotropic Conductive Paste And Light-emitting Device
App 20120248495 - Umakoshi; Hideaki ;   et al.
2012-10-04

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