Ishida; Toshiharu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ishida; Toshiharu.The latest application filed is for "pb-free solder-connected structure".
- Ishida; Toshiharu - Fujisawa JP
- Ishida; Toshiharu - Fujisawa-shi JP
- Ishida, Toshiharu - Atsugi-shi JP
| Patent | Date |
|---|---|
| Pb-free solder-connected structure Grant 8,907,475 - Shimokawa , et al. December 9, 2 | 2014-12-09 |
| Pb-FREE SOLDER-CONNECTED STRUCTURE App 20130286621 - SHIMOKAWA; Hanae ; et al. | 2013-10-31 |
| Pb-free solder-connected structure and electronic device Grant 8,503,189 - Shimokawa , et al. August 6, 2 | 2013-08-06 |
| Pb-free solder-connected structure and electronic device App 20100214753 - SHIMOKAWA; Hanae ; et al. | 2010-08-26 |
| Solder foil, semiconductor device and electronic device Grant 7,722,962 - Soga , et al. May 25, 2 | 2010-05-25 |
| Pb-free solder-connected structure and electronic device Grant 7,709,746 - Shimokawa , et al. May 4, 2 | 2010-05-04 |
| Pb-free solder-connected structure and electronic device App 20060115994 - Shimokawa; Hanae ; et al. | 2006-06-01 |
| Solder foil semiconductor device and electronic device App 20060061974 - Soga; Tasao ; et al. | 2006-03-23 |
| Method of producing an electronic device having a PB free solder connection Grant 7,013,564 - Shimokawa , et al. March 21, 2 | 2006-03-21 |
| Pb-free solder-connected structure and electronic device Grant 6,960,396 - Shimokawa , et al. November 1, 2 | 2005-11-01 |
| Electronic apparatus App 20040177997 - Hata, Hanae ; et al. | 2004-09-16 |
| Electronic device Grant 6,774,490 - Soga , et al. August 10, 2 | 2004-08-10 |
| Inventory management method, inventory management apparatus, and recording medium App 20040128214 - Ishida, Toshiharu ; et al. | 2004-07-01 |
| Circuit board and electronic device, and method of manufacturing same App 20030184986 - Soga, Tasao ; et al. | 2003-10-02 |
| Electron device and semiconductor device App 20030186072 - Soga, Tasao ; et al. | 2003-10-02 |
| Product using Zn-Al alloy solder Grant 6,563,225 - Soga , et al. May 13, 2 | 2003-05-13 |
| Electron device and semiconductor device Grant 6,555,052 - Soga , et al. April 29, 2 | 2003-04-29 |
| Pb-free solder-connected structure and electronic device App 20020163085 - Shimokawa, Hanae ; et al. | 2002-11-07 |
| Product using Zn-Al alloy solder App 20020149114 - Soga, Tasao ; et al. | 2002-10-17 |
| Electron device and semiconductor device App 20020066583 - Soga, Tasao ; et al. | 2002-06-06 |
| Pb-free solder-connected structure and electronic device App 20020019077 - Shimokawa, Hanae ; et al. | 2002-02-14 |
| Technical field App 20020009610 - Shimokawa, Hanae ; et al. | 2002-01-24 |
| Method and apparatus of manufacturing an electronic circuit board Grant 6,204,490 - Soga , et al. March 20, 2 | 2001-03-20 |
| Semiconductor device with reinforcement Grant 5,440,171 - Miyano , et al. August 8, 1 | 1995-08-08 |
| Method for producing electronic part mounting structure Grant 5,421,081 - Sakaguchi , et al. June 6, 1 | 1995-06-06 |
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