Ishida; Nobumasa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ishida; Nobumasa.The latest application filed is for "electroless copper plating solution and process for formation of copper film".
- Ishida; Nobumasa - Chiryu JP
- Ishida; Nobumasa - Nagoya JP
| Patent | Date |
|---|---|
| Electroless copper plating solution and process for formation of copper film Grant 5,965,211 - Kondo , et al. October 12, 1 | 1999-10-12 |
| Method and an apparatus for detecting concentration of a chemical treating solution and an automatic control apparatus thereof Grant 5,450,870 - Suga , et al. September 19, 1 | 1995-09-19 |
| Semiconductor element-mounting printed board Grant 5,248,853 - Ishikawa , et al. September 28, 1 | 1993-09-28 |
| Electroless copper plating solution and process for formation of copper film Grant 5,039,338 - Kondo , et al. August 13, 1 | 1991-08-13 |
| Electroless copper plating solution Grant 4,956,014 - Kondo , et al. * September 11, 1 | 1990-09-11 |
| Electroless copper plating solution Grant 4,814,009 - Kondo , et al. March 21, 1 | 1989-03-21 |
| Gypsum moldings as building materials and methods manufacturing the said gypsum moldings Grant 4,239,716 - Ishida , et al. December 16, 1 | 1980-12-16 |
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