Ishibashi; Seiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ishibashi; Seiko.The latest application filed is for "sn-cu-based lead-free solder alloy".
- Ishibashi; Seiko - Tokyo JP
- Ishibashi; Seiko - Adachi-ku JP
| Patent | Date |
|---|---|
| Sn-Cu-based lead-free solder alloy Grant 10,137,536 - Ohnishi , et al. November 27, 2 | 2018-11-27 |
| Lead-free solder alloy Grant 9,844,837 - Shimamura , et al. December 19, 2 | 2017-12-19 |
| Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part Grant 9,773,721 - Yoshikawa , et al. September 26, 2 | 2017-09-26 |
| Sn-cu-based Lead-free Solder Alloy App 20150029670 - Ohnishi; Tsukasa ; et al. | 2015-01-29 |
| Solder alloy Grant 8,932,519 - Ishibashi , et al. January 13, 2 | 2015-01-13 |
| Lead-free Solder Alloy, Connecting Member And A Method For Its Manufacture, And Electronic Part App 20140326490 - Yoshikawa; Shunsaku ; et al. | 2014-11-06 |
| Lead-Free Solder Alloy App 20140141273 - Shimamura; Masato ; et al. | 2014-05-22 |
| Solder Alloy App 20130343809 - Ishibashi; Seiko ; et al. | 2013-12-26 |
| Lead-free Solder Alloy, Connecting Member And A Method For Its Manufacture, And Electronic Part App 20120199393 - Yoshikawa; Shunsaku ; et al. | 2012-08-09 |
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