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Patent applications and USPTO patent grants for Ishibashi; Masahiro.The latest application filed is for "conveyance device using carriage".
Patent | Date |
---|---|
Conveyance device using carriage Grant 10,556,747 - Ishibashi , et al. Feb | 2020-02-11 |
Conveyance Device Using Carriage App 20190031444 - Ishibashi; Masahiro ;   et al. | 2019-01-31 |
Cart-type transporting device Grant 10,087,007 - Ishibashi , et al. October 2, 2 | 2018-10-02 |
Cart-type transporting device Grant 9,969,557 - Ishibashi , et al. May 15, 2 | 2018-05-15 |
Charge pump circuit and step-down regulator circuit Grant 9,929,646 - Notoya , et al. March 27, 2 | 2018-03-27 |
Slat conveyor Grant 9,796,531 - Ishibashi , et al. October 24, 2 | 2017-10-24 |
Cart-Type Transporting Device App 20170253434 - Ishibashi; Masahiro ;   et al. | 2017-09-07 |
Cart-Type Transporting Device App 20170240359 - Ishibashi; Masahiro ;   et al. | 2017-08-24 |
Charge Pump Circuit And Step-down Regulator Circuit App 20170179819 - NOTOYA; Koichi ;   et al. | 2017-06-22 |
Slat Conveyor App 20160145048 - Ishibashi; Masahiro ;   et al. | 2016-05-26 |
Hearing aid Grant 8,538,056 - Ishibashi , et al. September 17, 2 | 2013-09-17 |
Fixing Jig Fatigue Testing Test Piece, And Fatigue Testing Device App 20130036828 - Kaga; Yukari ;   et al. | 2013-02-14 |
Hearing Aid App 20120321114 - Ishibashi; Masahiro ;   et al. | 2012-12-20 |
Eartip retainer for hearing aids Grant D672,875 - Ishibashi , et al. December 18, 2 | 2012-12-18 |
Eartip retainer for hearing aids Grant D672,874 - Ishibashi , et al. December 18, 2 | 2012-12-18 |
Wiring board, semiconductor device, and method for manufacturing wiring board Grant 8,058,565 - Kiuchi , et al. November 15, 2 | 2011-11-15 |
Insulation material of reactive elastomer, epoxy resin, curing agent and crosslinked rubber Grant 7,981,963 - Kiuchi , et al. July 19, 2 | 2011-07-19 |
Wiring Board, Semiconductor Device, And Method For Manufacturing Wiring Board App 20070274060 - Kiuchi; Yukihiro ;   et al. | 2007-11-29 |
Insulation Material, Wiring Board, And Semiconductor Device App 20070251721 - Kiuchi; Yukihiro ;   et al. | 2007-11-01 |
Semiconductor device and printed wiring board having electrode pads App 20030121698 - Kyougoku, Yoshitaka ;   et al. | 2003-07-03 |
Mass flow control method and device utilizing a sonic nozzle Grant 6,012,474 - Takamoto , et al. January 11, 2 | 2000-01-11 |
Master slice type semiconductor integrated circuit having 2 or more I/O cells per connection pad Grant 4,942,317 - Tanaka , et al. July 17, 1 | 1990-07-17 |
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