Iruvanti; Sushumna

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iruvanti; Sushumna.The latest application filed is for "conformal integrated circuit (ic) device package lid".

Company Profile

13.58.35

Iruvanti; Sushumna - Wappingers Falls NY
Iruvanti; Sushumna - Hopewell Junction NY US
Iruvanti; Sushumna - Wappingers NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laminated stiffener to control the warpage of electronic chip carriers Grant 11,302,651 - Sikka , et al. April 12, 2	2022-04-12
Hybrid TIMs for electronic package cooling Grant 11,264,306 - Sikka , et al. March 1, 2	2022-03-01
Conformal integrated circuit (IC) device package lid Grant 11,158,562 - Lewison , et al. October 26, 2	2021-10-26
Localized catalyst for enhanced thermal interface material heat transfer Grant 11,152,282 - Arvin , et al. October 19, 2	2021-10-19
Conformal Integrated Circuit (IC) Device Package Lid App 20210249333 - Lewison; David J. ; et al.	2021-08-12
Mitigating Moisture-driven Degradation Of Features Designed To Prevent Structural Failure Of Semiconductor Wafers App 20210118819 - IRUVANTI; SUSHUMNA ; et al.	2021-04-22
HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING App 20210098334 - Sikka; Kamal K. ; et al.	2021-04-01
Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers Grant 10,892,233 - Iruvanti , et al. January 12, 2	2021-01-12
Heterogeneous thermal interface material for corner and or edge degradation mitigation Grant 10,804,181 - Interrante , et al. October 13, 2	2020-10-13
Heterogeneous Thermal Interface Material for Corner and or Edge Degradation Mitigation App 20200294880 - Interrante; Marcus E. ; et al.	2020-09-17
Mitigating Moisture-driven Degradation Of Features Designed To Prevent Structural Failure Of Semiconductor Wafers App 20200135662 - IRUVANTI; SUSHUMNA ; et al.	2020-04-30
Method of forming an electronic package Grant 10,636,746 - Sikka , et al.	2020-04-28
Reduction of laminate failure in integrated circuit (IC) device carrier Grant 10,607,928 - Call , et al.	2020-03-31
Lid attach optimization to limit electronic package warpage Grant 10,593,564 - Iruvanti , et al.	2020-03-17
Laminated Stiffener To Control The Warpage Of Electronic Chip Carriers App 20200013732 - Sikka; Kamal K. ; et al.	2020-01-09
Laminated Stiffener To Control The Warpage Of Electronic Chip Carriers App 20190267332 - SIKKA; Kamal K. ; et al.	2019-08-29
Test cell for laminate and method Grant 10,381,276 - Iruvanti , et al. A	2019-08-13
Lid attach optimization to limit electronic package warpage Grant 10,332,813 - Iruvanti , et al.	2019-06-25
Test cell for laminate and method Grant 10,249,548 - Iruvanti , et al.	2019-04-02
Lid attach optimization to limit electronic package warpage Grant 10,083,886 - Iruvanti , et al. September 25, 2	2018-09-25
Lid Attach Optimization To Limit Electronic Package Warpage App 20180233381 - Iruvanti; Sushumna ; et al.	2018-08-16
Lid attach optimization to limit electronic package warpage Grant 10,049,896 - Iruvanti , et al. August 14, 2	2018-08-14
Lid attach optimization to limit electronic package warpage Grant 9,947,603 - Iruvanti , et al. April 17, 2	2018-04-17
Test Cell For Laminate And Method App 20180076101 - Iruvanti; Sushumna ; et al.	2018-03-15
Lid Attach Optimization To Limit Electronic Package Warpage App 20180068916 - Iruvanti; Sushumna ; et al.	2018-03-08
Lid Attach Optimization To Limit Electronic Package Warpage App 20180068917 - Iruvanti; Sushumna ; et al.	2018-03-08
Test Cell For Laminate And Method App 20170178982 - Iruvanti; Sushumna ; et al.	2017-06-22
Lid Attach Optimization To Limit Electronic Package Warpage App 20170170086 - Iruvanti; Sushumna ; et al.	2017-06-15
Lid Attach Optimization To Limit Electronic Package Warpage App 20170170030 - Iruvanti; Sushumna ; et al.	2017-06-15
High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites Grant 9,512,291 - Borca-Tasciuc , et al. December 6, 2	2016-12-06
High Thermal Conductance Thermal Interface Materials Based On Nanostructured Metallic Network-polymer Composites App 20150247019 - Borca-Tasciuc; Theodorian ; et al.	2015-09-03
High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites Grant 9,045,674 - Iruvanti , et al. June 2, 2	2015-06-02
Thermal paste containment for semiconductor modules Grant 8,531,025 - Edwards , et al. September 10, 2	2013-09-10
Method and package for circuit chip packaging Grant 8,455,998 - Iruvanti , et al. June 4, 2	2013-06-04
Reliability enhancement of metal thermal interface Grant 8,232,636 - Humenik , et al. July 31, 2	2012-07-31
High Thermal Conductance Thermal Interface Materials Based On Nanostructured Metallic Network-polymer Composites App 20120187332 - Iruvanti; Sushumna ; et al.	2012-07-26
Patterned metal thermal interface Grant 8,156,998 - Furman , et al. April 17, 2	2012-04-17
Method And Package For Circuit Chip Packaging App 20120018873 - Iruvanti; Sushumna ; et al.	2012-01-26
Method and package for circuit chip packaging Grant 8,053,284 - Iruvanti , et al. November 8, 2	2011-11-08
Thermal paste containment for semiconductor modules Grant 8,021,925 - Edwards , et al. September 20, 2	2011-09-20
Reliability Enhancement Of Metal Thermal Interface App 20110180923 - HUMENIK; JAMES N. ; et al.	2011-07-28
Reversible thermal thickening grease Grant 7,981,849 - Feger , et al. July 19, 2	2011-07-19
Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly Grant 7,964,542 - Sachdev , et al. June 21, 2	2011-06-21
Method And Package For Circuit Chip Packaging App 20110037167 - Iruvanti; Sushumna ; et al.	2011-02-17
Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package Grant 7,816,785 - Iruvanti , et al. October 19, 2	2010-10-19
Low Compressive Force, Non-silicone, High Thermal Conducting Formulation For Thermal Interface Material And Package App 20100181663 - IRUVANTI; SUSHUMNA ; et al.	2010-07-22
Patterned Metal Thermal Interface App 20100147497 - FURMAN; BRUCE K. ; et al.	2010-06-17
Thermal pillow Grant 7,709,951 - Brodsky , et al. May 4, 2	2010-05-04
Patterned metal thermal interface Grant 7,694,719 - Furman , et al. April 13, 2	2010-04-13
Method and device including reworkable alpha particle barrier and corrosion barrier Grant 7,615,850 - Choudhary , et al. November 10, 2	2009-11-10
Chip Cooling System with Convex Portion App 20090109628 - Bezama; Raschid J. ; et al.	2009-04-30
Thermal Paste Containment For Semiconductor Modules App 20080299707 - Edwards; David L. ; et al.	2008-12-04
Thermal Pillow App 20080225484 - Brodsky; William L. ; et al.	2008-09-18
Method And Device Including Reworkable Alpha Particle Barrier And Corrosion Barrier App 20080217793 - CHOUDHARY; Rehan ; et al.	2008-09-11
Reversible Thermal Thickening Grease App 20080220998 - Feger; Claudius ; et al.	2008-09-11
Patterned Metal Thermal Interface App 20080165502 - Furman; Bruce K. ; et al.	2008-07-10
Method and device including reworkable alpha particle barrier and corrosion barrier Grant 7,381,590 - Choudhary , et al. June 3, 2	2008-06-03
Thermal Paste Containment For Semiconductor Modules App 20070222064 - Edwards; David L. ; et al.	2007-09-27
Method And Device Including Reworkable Alpha Particle Barrier And Corrosion Barrier App 20070212820 - Choudhary; Rehan ; et al.	2007-09-13
Thermal paste containment for semiconductor modules Grant 7,268,428 - Edwards , et al. September 11, 2	2007-09-11
Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly App 20070161521 - Sachdev; Krishna G. ; et al.	2007-07-12
Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip Grant 7,239,516 - Long , et al. July 3, 2	2007-07-03
Thermal Paste Containment For Semiconductor Modules App 20070045819 - Edwards; David L. ; et al.	2007-03-01
Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip App 20060056156 - Long; David C. ; et al.	2006-03-16
Thermal paste for low temperature applications Grant 6,656,389 - Iruvanti , et al. December 2, 2	2003-12-02
Thermal paste for low temperature applications App 20030004066 - Iruvanti, Sushumna ; et al.	2003-01-02
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof Grant 6,444,496 - Edwards , et al. September 3, 2	2002-09-03
Multi-chip module and heat-sink cap combination Grant 6,373,133 - DiGiacomo , et al. April 16, 2	2002-04-16
Method for bonding heatsink to multiple-height chip App 20020017715 - Giacomo, Giulio Di ; et al.	2002-02-14
Method for controlling thermal interface gap distance Grant 6,294,408 - Edwards , et al. September 25, 2	2001-09-25
Thermal Paste Preforms As A Heat Transfer Media Between A Chip And A Heat Sink And Method Thereof App 20010021102 - EDWARDS, DAVID L ; et al.	2001-09-13
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof Grant 6,275,381 - Edwards , et al. August 14, 2	2001-08-14
Method for providing a thermal path through particles embedded in a thermal cap Grant 6,255,139 - Edwards , et al. July 3, 2	2001-07-03
Method for bonding heatsink to multiple-height chip Grant 6,214,647 - Di Giacomo , et al. April 10, 2	2001-04-10
Thermal cap with embedded particles Grant 6,111,314 - Edwards , et al. August 29, 2	2000-08-29
Direct chip-cooling through liquid vaporization heat exchange Grant 6,085,831 - DiGiacomo , et al. July 11, 2	2000-07-11
Hermetic CBGA/CCGA structure with thermal paste cooling Grant 5,990,418 - Bivona , et al. November 23, 1	1999-11-23
Reworkable polymer chip encapsulant Grant 5,930,597 - Call , et al. July 27, 1	1999-07-27
Multi-layer solder seal band for semiconductor substrates and process Grant 5,881,945 - Edwards , et al. March 16, 1	1999-03-16
Integral mesh flat plate cooling module Grant 5,825,087 - Iruvanti , et al. October 20, 1	1998-10-20
Method for cooling of chips using blind holes with customized depth Grant 5,819,402 - Edwards , et al. October 13, 1	1998-10-13
Integral mesh flat plate cooling method Grant 5,770,478 - Iruvanti , et al. June 23, 1	1998-06-23
Apparatus for cooling of chips using blind holes with customized depth Grant 5,757,620 - Edwards , et al. May 26, 1	1998-05-26
Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials Grant 5,724,729 - Sherif , et al. March 10, 1	1998-03-10
Flat plate cooling using a thermal paste retainer Grant 5,706,171 - Edwards , et al. January 6, 1	1998-01-06
Reworkable polymer chip encapsulant Grant 5,659,203 - Call , et al. August 19, 1	1997-08-19
Apparatus for cooling of chips using a plurality of customized thermally conductive materials Grant 5,623,394 - Sherif , et al. April 22, 1	1997-04-22
Method for cooling of chips using a plurality of materials Grant 5,604,978 - Sherif , et al. February 25, 1	1997-02-25
Polyester dispersants for high thermal conductivity paste Grant 5,591,789 - Iruvanti , et al. January 7, 1	1997-01-07
Stable high solids, high thermal conductivity pastes Grant 5,098,609 - Iruvanti , et al. March 24, 1	1992-03-24