Irisawa; Munetoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Irisawa; Munetoshi.The latest application filed is for "photosensitive resin composition, etching method and plating method".

Company Profile

3.7.7

Irisawa; Munetoshi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photosensitive resin composition, etching method and plating method Grant 11,142,620 - Irisawa , et al. October 12, 2	2021-10-12
Photosensitive resin composition and etching process Grant 10,990,010 - Irisawa , et al. April 27, 2	2021-04-27
Photosensitive Resin Composition, Etching Method And Plating Method App 20200012190 - IRISAWA; Munetoshi ; et al.	2020-01-09
Photosensitive Resin Composition And Etching Process App 20180046079 - IRISAWA; Munetoshi ; et al.	2018-02-15
Method for electroconductive pattern formation Grant 8,546,066 - Irisawa , et al. October 1, 2	2013-10-01
Method for forming resist pattern, method for producing circuit board, and circuit board Grant 8,143,533 - Kaneda , et al. March 27, 2	2012-03-27
Method For Electroconductive Pattern Formation App 20100330504 - Irisawa; Munetoshi ; et al.	2010-12-30
Circuit board manufacturing method and circuit board Grant 7,679,004 - Fukase , et al. March 16, 2	2010-03-16
Method for Forming Resist Pattern, Method for Producing Circuit Board, and Circuit Board App 20090236137 - Kaneda; Yasuo ; et al.	2009-09-24
Method for Manufacturing Screen Printing Mask With Resin and Screen Printing Mask With Resin App 20090173245 - Irisawa; Munetoshi ; et al.	2009-07-09
Circuit board manufacturing method and circuit board App 20070181994 - Fukase; Katsuya ; et al.	2007-08-09
Process for producing printed wiring board Grant 6,645,685 - Takata , et al. November 11, 2	2003-11-11
Process for producing printed wiring board App 20020102772 - Takata, Masakazu ; et al.	2002-08-01

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