| Patent | Date |
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Liquid Cartridge
App 20220184951 - Hashimoto; Yusuke ; et al. | 2022-06-16 |
Liquid Ejection Head
App 20220143982 - Watanabe; Makoto ; et al. | 2022-05-12 |
Liquid Ejection Head And Manufacturing Method Thereof
App 20220032625 - Hashimoto; Yusuke ; et al. | 2022-02-03 |
Liquid Discharge Cartridge Manufacturing Method And Liquid Discharge Head
App 20210387455 - Hasegawa; Shuichi ; et al. | 2021-12-16 |
Liquid Storage Container
App 20210370682 - MURAKAMI; Taketsugu ; et al. | 2021-12-02 |
Ink Container And Inkjet Printer
App 20210283917 - Atsuta; Tomohisa ; et al. | 2021-09-16 |
Liquid ejection head
Grant 10,328,696 - Ishii , et al. | 2019-06-25 |
Element substrate, liquid ejection head, and liquid ejection apparatus
Grant 10,259,221 - Iri , et al. | 2019-04-16 |
Element Substrate, Liquid Ejection Head, And Liquid Ejection Apparatus
App 20180065367 - Iri; Junichiro ; et al. | 2018-03-08 |
Liquid Ejection Head
App 20180065366 - Ishii; Kazuhiro ; et al. | 2018-03-08 |
Circuit board and liquid ejection head
Grant 9,832,864 - Iri , et al. November 28, 2 | 2017-11-28 |
Circuit Board And Liquid Ejection Head
App 20160353565 - Iri; Junichiro ; et al. | 2016-12-01 |
Method for manufacturing liquid ejection head substrate
Grant 9,333,749 - Kato , et al. May 10, 2 | 2016-05-10 |
Method For Manufacturing Liquid Ejection Head Substrate
App 20130139388 - Kato; Masataka ; et al. | 2013-06-06 |
Dicing method, program for the dicing method, and storage medium for the dicing method
Grant 8,316,744 - Iri November 27, 2 | 2012-11-27 |
Printing head and manufacturing method of printing head
Grant 8,162,444 - Miura , et al. April 24, 2 | 2012-04-24 |
Laser cutting method
Grant 8,108,998 - Inada , et al. February 7, 2 | 2012-02-07 |
Laser cutting apparatus and laser cutting method
Grant 8,093,530 - Nishiwaki , et al. January 10, 2 | 2012-01-10 |
Method For Dicing Wafer And Process For Manufacturing Liquid-discharging Head Using The Dicing Method
App 20110027970 - Iri; Junichiro ; et al. | 2011-02-03 |
Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method
Grant 7,837,820 - Iri , et al. November 23, 2 | 2010-11-23 |
Laser processing apparatus and laser processing method
Grant 7,807,940 - Nishiwaki , et al. October 5, 2 | 2010-10-05 |
Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus
Grant 7,791,001 - Nishiwaki , et al. September 7, 2 | 2010-09-07 |
Dicing Method, Program For The Dicing Method, And Storage Medium For The Dicing Method
App 20090314144 - Iri; Junichiro | 2009-12-24 |
Printing Head And Manufacturing Method Of Printing Head
App 20090309931 - Miura; Shinya ; et al. | 2009-12-17 |
Method For Dicing Wafer And Process For Manufacturing Liquid-discharging Head Using The Dicing Method
App 20090242111 - Iri; Junichiro ; et al. | 2009-10-01 |
Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method
Grant 7,569,118 - Iri , et al. August 4, 2 | 2009-08-04 |
Laser based splitting method, object to be split, and semiconductor element chip
Grant 7,211,526 - Iri , et al. May 1, 2 | 2007-05-01 |
Method of manufacturing a liquid jet recording head
Grant 7,171,748 - Kigami , et al. February 6, 2 | 2007-02-06 |
Method for laser cutting and method of producing function elements
App 20060258047 - Nishiwaki; Masayuki ; et al. | 2006-11-16 |
Laser cutting method
App 20060113287 - Inada; Genji ; et al. | 2006-06-01 |
Laser processing apparatus and laser processing method
App 20060108339 - Nishiwaki; Masayuki ; et al. | 2006-05-25 |
Laser cutting apparatus and laser cutting method
App 20060108338 - Nishiwaki; Masayuki ; et al. | 2006-05-25 |
Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus
App 20060109757 - Nishiwaki; Masayuki ; et al. | 2006-05-25 |
Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method
App 20050241754 - Iri, Junichiro ; et al. | 2005-11-03 |
Laser based splitting method, object to be split, and semiconductor element chip
App 20050199592 - Iri, Junichiro ; et al. | 2005-09-15 |
Ink jet recording head, ink jet recording apparatus using such ink jet recording head, and method for manufacturing ink jet recording head
Grant 6,799,841 - Iri , et al. October 5, 2 | 2004-10-05 |
Liquid ejection head and method of manufacturing the liquid ejection head
Grant 6,752,489 - Ohashi , et al. June 22, 2 | 2004-06-22 |
Manufacturing method of liquid jet recording head
App 20040040152 - Kigami, Hiroyuki ; et al. | 2004-03-04 |
Ink-jet head substrate, ink-jet head and ink-jet recording apparatus
Grant 6,644,790 - Ozaki , et al. November 11, 2 | 2003-11-11 |
Ink jet recording head, ink jet recording apparatus using such ink jet recording head, and method for manufacturing ink jet recording head
App 20030067517 - Iri, Junichiro ; et al. | 2003-04-10 |
Ink jet head substrate, ink jet head, method for manufacturing ink jet head substrate, method for manufacturing ink jet head, method for using ink jet head and ink jet recording apparatus
Grant 6,530,650 - Ozaki , et al. March 11, 2 | 2003-03-11 |
Liquid ejection head and method of manufacturing the liquid ejection head
App 20020075357 - Ohashi, Tetsuya ; et al. | 2002-06-20 |
Liquid discharge head, method for manufacturing liquid discharge head, head cartridge on which liquid discharge head is mounted, and liquid discharge apparatus
App 20020027577 - Sugiyama, Hiroyuki ; et al. | 2002-03-07 |
Ink jet head substrate, ink jet head, method for manufacturing ink jet head substrate, method for manufacturing ink jet head, method for using ink jet head and ink jet recording apparatus
App 20020024564 - Ozaki, Teruo ; et al. | 2002-02-28 |
Ink-jet head substrate, ink-jet head and ink-jet recording apparatus
App 20020024565 - Ozaki, Teruo ; et al. | 2002-02-28 |
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