Inui; Yasuhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Inui; Yasuhiko.The latest application filed is for "multilayer heating body".

Company Profile

2.6.6

Inui; Yasuhiko - Kani JP
INUI; Yasuhiko - Kani-shi JP
Inui; Yasuhiko - Gifu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multilayer heating body Grant 11,013,068 - Tosa , et al. May 18, 2	2021-05-18
Heating member, electrostatic chuck, and ceramic heater Grant 10,347,521 - Ishikawa , et al. July 9, 2	2019-07-09
Multilayer Heating Body App 20170359859 - TOSA; Akifumi ; et al.	2017-12-14
Heating Member, Electrostatic Chuck, And Ceramic Heater App 20170110357 - ISHIKAWA; Hironobu ; et al.	2017-04-20
Method of manufacturing a dielectric structure Grant 8,813,353 - Inui , et al. August 26, 2	2014-08-26
Dielectric Lamination Structure, Manufacturing Method Of A Dielectric Lamination Structure, And Wiring Board Including A Dielectric Lamination Structure App 20100242271 - Inui; Yasuhiko ; et al.	2010-09-30
Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure Grant 7,750,248 - Inui , et al. July 6, 2	2010-07-06
Built-in capacitor type wiring board and method for manufacturing the same Grant 7,532,453 - Yamamoto , et al. May 12, 2	2009-05-12
Wiring Board and Wiring Board Manufacturing Method App 20080289866 - Yuri; Shinji ; et al.	2008-11-27
Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure App 20070125575 - Inui; Yasuhiko ; et al.	2007-06-07
Built-in capacitor type wiring board and method for manufacturing the same App 20070121273 - Yamamoto; Hiroshi ; et al.	2007-05-31

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