loadpatents
Patent applications and USPTO patent grants for Inui; Tadahisa.The latest application filed is for "lead frame, molding die, and molding method".
Patent | Date |
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Lead Frame, Molding Die, And Molding Method App 20080253104 - Inui; Tadahisa | 2008-10-16 |
Lead frame and semiconductor device Grant 7,190,055 - Inui , et al. March 13, 2 | 2007-03-13 |
Lead frame and semiconductor device App 20060220190 - Inui; Tadahisa ;   et al. | 2006-10-05 |
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