Patent applications and USPTO patent grants for Interplex Industries, Inc..The latest application filed is for "multipart connector for conveying power".
Patent | Date |
---|---|
EMC shield and method of producing the same Grant 11,432,442 - Parrish , et al. August 30, 2 | 2022-08-30 |
Method of manufacturing a press-fit contact Grant 11,431,141 - Schneider August 30, 2 | 2022-08-30 |
Multipart Connector For Conveying Power App 20220209433 - Qian; Yin ;   et al. | 2022-06-30 |
Laminated wire connector Grant 11,362,444 - Schneider June 14, 2 | 2022-06-14 |
Multi-part Contact App 20220102896 - Schneider; Richard | 2022-03-31 |
Battery Cell Interconnect System App 20210391602 - Kennedy; Craig ;   et al. | 2021-12-16 |
Emc Shield And Method Of Producing The Same App 20210345530 - Parrish; Jeffrey D ;   et al. | 2021-11-04 |
Contact with a press-fit fastener Grant 11,095,057 - Parrish August 17, 2 | 2021-08-17 |
Laminated Wire Connector App 20210184375 - Schneider; Richard | 2021-06-17 |
Electrical connector Grant 10,998,675 - Lynch , et al. May 4, 2 | 2021-05-04 |
Press-fit contact pin Grant 10,916,868 - Bogursky February 9, 2 | 2021-02-09 |
Electrical connector Grant 10,784,623 - Schneider , et al. Sept | 2020-09-22 |
Electrical assembly with a multilayer bus board Grant 10,779,392 - Schneider , et al. Sept | 2020-09-15 |
Contact With A Press-fit Fastener App 20200280144 - Parrish; Jeffrey D. | 2020-09-03 |
Electrical connector Grant 10,763,607 - Schneider Sep | 2020-09-01 |
Electrical Connector App 20200274294 - Lynch; Joseph ;   et al. | 2020-08-27 |
Connector housing Grant 10,700,462 - Schneider | 2020-06-30 |
Electrical Connector App 20200067234 - Schneider; Richard ;   et al. | 2020-02-27 |
Electrical Assembly With A Multilayer Bus Board App 20200060022 - Schneider; Richard ;   et al. | 2020-02-20 |
Press-fit Contact Pin App 20200028287 - Bogursky; Robert M. | 2020-01-23 |
Electrical connector Grant 10,522,945 - Schneider , et al. Dec | 2019-12-31 |
Multilayer bus board Grant 10,485,092 - Schneider , et al. Nov | 2019-11-19 |
Connector Housing App 20190221957 - Schneider; Richard | 2019-07-18 |
Electrical Connector App 20190181575 - Schneider; Richard | 2019-06-13 |
Electrical Connector App 20190081439 - Schneider; Richard ;   et al. | 2019-03-14 |
Multilayer Bus Board App 20180049310 - Schneider; Richard ;   et al. | 2018-02-15 |
Planar contact with solder Grant 9,155,200 - Seidler October 6, 2 | 2015-10-06 |
Large deflection constrained insulation displacement terminal and connector Grant 8,708,733 - Parrish April 29, 2 | 2014-04-29 |
Inter-board connection system with compliant flexible pin deformation prevention Grant 8,690,586 - Schneider April 8, 2 | 2014-04-08 |
Planar Contact with Solder App 20130283608 - Seidler; Jack | 2013-10-31 |
Planar contact with solder Grant 8,497,429 - Seidler July 30, 2 | 2013-07-30 |
Solderless electronic component or capacitor mount assembly Grant 8,305,769 - Schneider November 6, 2 | 2012-11-06 |
Lead frame thermoplastic solar cell receiver Grant 7,977,777 - Federici , et al. July 12, 2 | 2011-07-12 |
Planar Contact With Solder App 20100236815 - Seidler; Jack | 2010-09-23 |
Solderless Electronic Component Or Capacitor Mount Assembly App 20100124036 - Schneider; Richard | 2010-05-20 |
Lead Frame Thermoplastic Solar Cell Receiver App 20090298218 - Federici; Domenico J. ;   et al. | 2009-12-03 |
Tin-silver Compound Coating On Printed Circuit Boards App 20090283305 - Lynch; Joseph J. ;   et al. | 2009-11-19 |
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