International Bushiness Machines Corporation
Patent Applications and Registrations
Patent applications and USPTO patent grants for International Bushiness Machines Corporation.The latest application filed is for "copper post solder bumps on substrates".
- International Bushiness Machines Corporation - Armonk NY US
| Patent | Date |
|---|---|
| Process for enhanced 3D integration and structures generated using the same Grant 9,111,925 - Colgan , et al. August 18, 2 | 2015-08-18 |
| Copper Post Solder Bumps On Substrates App 20150031173 - NAH; Jae-Woong ; et al. | 2015-01-29 |
| Process For Enhanced 3D Integration and Structures Generated Using the Same App 20130341791 - Colgan; Evan George ; et al. | 2013-12-26 |
| Document Sorting System Grant 3,645,392 - Chittenden , et al. February 29, 1 | 1972-02-29 |
| Associative Memory Grant 3,609,702 - Gardner , et al. September 28, 1 | 1971-09-28 |
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