Interconnexions Ceramiques
Patent Applications and Registrations
Patent applications and USPTO patent grants for Interconnexions Ceramiques.The latest application filed is for "monolithic substrate for an electronic power component and process for the production thereof".
- Interconnexions Ceramiques - Courbevoie FR
| Patent | Date |
|---|---|
| Monolithic substrate for an electronic power component and process for the production thereof Grant 4,859,520 - Dubuisson , et al. August 22, 1 | 1989-08-22 |
| Process for the manufacture of an interconnecting substrate for electronic components Grant 4,775,503 - Dubuisson October 4, 1 | 1988-10-04 |
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