Patent | Date |
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Connector Constructions For Electronic Applications App 20130090017 - Fjelstad; Joseph C. | 2013-04-11 |
Torsionally-induced Contact-force Conductors For Electrical Connector Systems App 20130078826 - Yasumura; Gary ;   et al. | 2013-03-28 |
Connector constructions for electronic applications Grant 8,333,617 - Fjelstad December 18, 2 | 2012-12-18 |
Connector having a housing with a conductor with a ramp section and a curved surface section Grant 8,313,333 - Yasumura , et al. November 20, 2 | 2012-11-20 |
Connector constructions for electronic applications Grant 8,246,387 - Fjelstad August 21, 2 | 2012-08-21 |
Torsionally-Induced Contact-Force Conductors for Electrical Connector Systems App 20120149250 - Yasumura; Gary ;   et al. | 2012-06-14 |
Electrical connector with conductors with a ramp to induce torsion Grant 8,079,848 - Yasumura , et al. December 20, 2 | 2011-12-20 |
Torsionally-Induced Contact-Force Conductors for Electrical Connector Systems App 20110171857 - Yasumura; Gary ;   et al. | 2011-07-14 |
Connection for Off-Chip Electrostatic Discharge Protection App 20110079912 - Marcoux; Phil P. | 2011-04-07 |
Torsionally-induced contact-force conductors for electrical connector systems Grant 7,909,615 - Yasumura , et al. March 22, 2 | 2011-03-22 |
Torsionally-Induced Contact-Force Conductors for Electrical Connector Systems App 20110065332 - Yasumura; Gary ;   et al. | 2011-03-17 |
Torsionally-induced contact-force conductors for electrical connector systems Grant 7,845,986 - Yasumura , et al. December 7, 2 | 2010-12-07 |
Method and Apparatus for Vertical Stacking of Integrated Circuit Chips App 20100289130 - Fjelstad; Joseph C. | 2010-11-18 |
ESD Protection Utilizing Radiated Thermal Relief App 20100284115 - Grundy; Kevin P. ;   et al. | 2010-11-11 |
Interconnection of IC Chips by Flex Circuit Superstructure App 20100258952 - Fjelstad; Joseph C. | 2010-10-14 |
Multi-Surface IC Packaging Structures and Methods for their Manufacture App 20100221871 - Fjelstad; Joseph C. ;   et al. | 2010-09-02 |
IC package structures having separate circuit interconnection structures and assemblies constructed thereof Grant 7,750,446 - Fjelstad , et al. July 6, 2 | 2010-07-06 |
Low Profile Discrete Electronic Components and Applications of Same App 20100165525 - Fjelstad; Joseph C. ;   et al. | 2010-07-01 |
High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for their Manufacture App 20100151704 - Yasumura; Gary ;   et al. | 2010-06-17 |
Multi-surface IC packaging structures and methods for their manufacture Grant 7,737,545 - Fjelstad , et al. June 15, 2 | 2010-06-15 |
Multi-surface contact IC packaging structures and assemblies Grant 7,732,904 - Fjelstad , et al. June 8, 2 | 2010-06-08 |
Interconnect System without Through-Holes App 20100127402 - Grundy; Kevin P. ;   et al. | 2010-05-27 |
Electrical Interconnection Devices Incorporating Redundant Contact Points for Reducing Capacitive Stubs and Improved Signal Integrity App 20100112829 - Yasamura; Gary ;   et al. | 2010-05-06 |
Low profile discrete electronic components and applications of same Grant 7,701,323 - Fjelstad , et al. April 20, 2 | 2010-04-20 |
High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture Grant 7,651,336 - Yasumura , et al. January 26, 2 | 2010-01-26 |
Interconnect system without through-holes Grant 7,652,381 - Grundy , et al. January 26, 2 | 2010-01-26 |
Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity Grant 7,651,382 - Yasumura , et al. January 26, 2 | 2010-01-26 |
Signal-segregating connector system Grant 7,613,011 - Grundy , et al. November 3, 2 | 2009-11-03 |
Controlled Impedance Structures for High Density Interconnections App 20090167334 - Fjelstad; Joseph C. ;   et al. | 2009-07-02 |
Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity Grant 7,404,746 - Yasumura , et al. July 29, 2 | 2008-07-29 |
Tapered dielectric and conductor structures and applications thereof Grant 7,388,279 - Fjelstad , et al. June 17, 2 | 2008-06-17 |