Inoue; Tsubasa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Inoue; Tsubasa.The latest application filed is for "semiconductor device".
- Inoue; Tsubasa - Osaka JP
- Inoue; Tsubasa - Osaka-fu JP
- Inoue; Tsubasa - Tokyo JP
- INOUE; Tsubasa - Chiyoda-ku Tokyo
| Patent | Date |
|---|---|
| Semiconductor Device App 20220157806 - YOSHIDA; Kazuma ; et al. | 2022-05-19 |
| Semiconductor device Grant 11,282,834 - Yoshida , et al. March 22, 2 | 2022-03-22 |
| Semiconductor Device App 20220029016 - OKAWA; Ryosuke ; et al. | 2022-01-27 |
| Semiconductor device Grant D938,925 - Okawa , et al. December 21, 2 | 2021-12-21 |
| Semiconductor device Grant D937,232 - Okawa , et al. November 30, 2 | 2021-11-30 |
| Semiconductor device Grant D937,233 - Okawa , et al. November 30, 2 | 2021-11-30 |
| Semiconductor device Grant 11,171,234 - Okawa , et al. November 9, 2 | 2021-11-09 |
| Semiconductor device Grant D934,820 - Okawa , et al. November 2, 2 | 2021-11-02 |
| Semiconductor Device App 20210233905 - Yoshida; Kazuma ; et al. | 2021-07-29 |
| Semiconductor device Grant 11,049,856 - Yoshida , et al. June 29, 2 | 2021-06-29 |
| Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board Grant 10,893,616 - Onozeki , et al. January 12, 2 | 2021-01-12 |
| Semiconductor Device App 20200388609 - YOSHIDA; Kazuma ; et al. | 2020-12-10 |
| Semiconductor Device App 20200365729 - OKAWA; Ryosuke ; et al. | 2020-11-19 |
| Multilayer Printed Wiring Board Production Method, Adhesive Layer-equipped Metal Foil, Metal-clad Laminate, And Multilayer Printed Wiring Board App 20180235090 - ONOZEKI; Hitoshi ; et al. | 2018-08-16 |
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