Inoue; Tomotoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Inoue; Tomotoshi.The latest application filed is for "method of forming wirings for integrated circuits by electroplating".
- Inoue; Tomotoshi - Kawasaki JP
- Inoue; Tomotoshi - Kanagawa JP
| Patent | Date |
|---|---|
| Method of forming wirings for integrated circuits by electroplating Grant 5,556,814 - Inoue , et al. September 17, 1 | 1996-09-17 |
| Semiconductor device having an improved air-bridge lead structure Grant 5,148,260 - Inoue , et al. September 15, 1 | 1992-09-15 |
| Semiconductor integrated circuit device having a hollow multi-layered lead structure Grant 5,034,799 - Tomita , et al. July 23, 1 | 1991-07-23 |
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