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INOUE; Tomoko Patent Filings

INOUE; Tomoko

Patent Applications and Registrations

Patent applications and USPTO patent grants for INOUE; Tomoko.The latest application filed is for "abnormality notification system, abnormality notification method, and program".

Company Profile
2.13.21
  • INOUE; Tomoko - Tokyo JP
  • Inoue; Tomoko - Ayase JP
  • INOUE; Tomoko - US
  • Inoue; Tomoko - Kanagawa JP
  • Inoue; Tomoko - Osaka-shi JP
  • Inoue; Tomoko - Osaka JP
  • Inoue; Tomoko - Yokohama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Abnormality Notification System, Abnormality Notification Method, And Program
App 20210137462 - KOGURE; Takamasa ;   et al.
2021-05-13
Posture Determination Apparatus
App 20210106256 - KOGURE; Takamasa ;   et al.
2021-04-15
Abnormality notification system, abnormality notification method, and program
Grant 10,925,545 - Kogure , et al. February 23, 2
2021-02-23
Evaluating Apparatus And Non-transitory Computer Readable Medium Storing Program
App 20190175103 - KOGURE; Takamasa ;   et al.
2019-06-13
Abnormality Notification System, Abnormality Notification Method, And Program
App 20180242918 - KOGURE; Takamasa ;   et al.
2018-08-30
Polycyclic pyrazolinone derivative and herbicide comprising same as effective component thereof
Grant 9,580,444 - Kobayashi , et al. February 28, 2
2017-02-28
Polycyclic Pyrazolinone Derivative And Herbicide Comprising Same As Effective Component Thereof
App 20160024110 - KOBAYASHI; Osamu ;   et al.
2016-01-28
Kimono
App 20150157064 - Inoue; Tomoko ;   et al.
2015-06-11
Semiconductor device having capacitor formed on plug, and method of forming the same
Grant 7,951,665 - Inoue , et al. May 31, 2
2011-05-31
Semiconductor device having capacitor element
Grant 7,923,816 - Inoue , et al. April 12, 2
2011-04-12
Semiconductor device with DRAM portion having capacitor-over-bit-line structure and logic portion
Grant 7,602,002 - Inoue , et al. October 13, 2
2009-10-13
Semiconductor device having capacitor formed on plug, and method of forming the same
App 20090140308 - Inoue; Ken ;   et al.
2009-06-04
Semiconductor Device Having Capacitor Element
App 20090140386 - INOUE; Ken ;   et al.
2009-06-04
Injection
App 20090036406 - Nakai; Shinichiro ;   et al.
2009-02-05
Method for manufacturing semiconductor device having plural electroconductive plugs
App 20070212831 - Inoue; Tomoko ;   et al.
2007-09-13
Semiconductor device and method of manufacturing the same
Grant 7,268,380 - Inoue September 11, 2
2007-09-11
Injectable composition
App 20070191286 - Doen; Takayuki ;   et al.
2007-08-16
Semiconductor device memory cell
Grant 7,247,904 - Inoue , et al. July 24, 2
2007-07-24
Semiconductor device having plural electroconductive plugs
Grant 7,238,980 - Inoue , et al. July 3, 2
2007-07-03
Semiconductor device memory cell
Grant 7,105,882 - Inoue , et al. September 12, 2
2006-09-12
Semiconductor device
App 20060192236 - Inoue; Tomoko ;   et al.
2006-08-31
Semiconductor device memory cell
App 20060186448 - Inoue; Tomoko ;   et al.
2006-08-24
Method of forming metal wiring line including using a first insulating film as a stopper film
Grant 7,091,123 - Tonegawa , et al. August 15, 2
2006-08-15
Manufacturing method of semiconductor device
Grant 7,067,427 - Tsuchiya , et al. June 27, 2
2006-06-27
Semiconductor device and method of manufacturing the same
App 20050056874 - Inoue, Tomoko
2005-03-17
Semiconductor device and method for manufacturing same
App 20050040449 - Inoue, Tomoko ;   et al.
2005-02-24
Semiconductor device and method for manufacturing same
App 20050037590 - Inoue, Tomoko ;   et al.
2005-02-17
Lowly heat-expandable laminate
Grant 6,815,053 - Inoue , et al. November 9, 2
2004-11-09
Lowly heat-expandable laminate
App 20040096680 - Inoue, Tomoko ;   et al.
2004-05-20
Slurry for polishing copper-based metal
App 20040020135 - Tsuchiya, Yasuaki ;   et al.
2004-02-05
Manufacturing method of semiconductor device
App 20040023483 - Tsuchiya, Yasuaki ;   et al.
2004-02-05
Method of forming metal wiring line
App 20030049927 - Tonegawa, Takashi ;   et al.
2003-03-13
Emulsifying composition
Grant 4,510,070 - Tsutsumi , et al. April 9, 1
1985-04-09

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