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Patent applications and USPTO patent grants for Inoue; Shu.The latest application filed is for "method of mounting electronic component, circuit board, solder joint portion, printed wiring board with connecting layer, and sheet-like joint member".
Patent | Date |
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Method of mounting electronic component to circuit board Grant 9,807,889 - Fujimoto , et al. October 31, 2 | 2017-10-31 |
Method Of Mounting Electronic Component, Circuit Board, Solder Joint Portion, Printed Wiring Board With Connecting Layer, And Sheet-like Joint Member App 20140029224 - FUJIMOTO; Kozo ;   et al. | 2014-01-30 |
Elastic roller Grant 7,162,180 - Takizawa , et al. January 9, 2 | 2007-01-09 |
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