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name:-0.011099815368652
name:-0.0030839443206787
name:-0.0014691352844238
INOUE; Hiroko Patent Filings

INOUE; Hiroko

Patent Applications and Registrations

Patent applications and USPTO patent grants for INOUE; Hiroko.The latest application filed is for "alicyclic epoxy compound product".

Company Profile
1.2.8
  • INOUE; Hiroko - Tokyo JP
  • Inoue; Hiroko - Ohtake JP
  • INOUE; Hiroko - Ohtake-shi JP
  • Inoue; Hiroko - Yamato JP
  • Inoue, Hiroko - Kawasaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Alicyclic Epoxy Compound Product
App 20220194913 - INOUE; Hiroko ;   et al.
2022-06-23
Epoxy-amine adduct, thermoplastic resin composition, sizing agent, sizing agent coated carbon fiber, and fiber-reinforced composite material
Grant 10,611,876 - Inoue , et al.
2020-04-07
Epoxy-amine Adduct, Thermoplastic Resin Composition, Sizing Agent, Sizing Agent Coated Carbon Fiber, And Fiber-reinforced Composite Material
App 20170029557 - INOUE; Hiroko ;   et al.
2017-02-02
Epoxy Compound, Production Method Therefor, And Curable Epoxy Resin Composition
App 20150291728 - Inoue; Hiroko
2015-10-15
Semiconductor device
App 20060087041 - Fukuyama; Shun-ichi ;   et al.
2006-04-27
Semiconductor device using low-K material as interlayer insulating film and its manufacture method
App 20050250309 - Fukuyama, Shun-ichi ;   et al.
2005-11-10
Semiconductor device using low-k material as interlayer insulating film and including a surface modifying layer
Grant 6,943,431 - Fukuyama , et al. September 13, 2
2005-09-13
Semiconductor device using low-k material as interlayer insulating film and its manufacture method
App 20040021224 - Fukuyama, Shun-ichi ;   et al.
2004-02-05
Semiconductor device including porous insulating material and manufacturing method therefor
App 20030057561 - Fukuyama, Shun-Ichi ;   et al.
2003-03-27
Composition for forming low dielectric constant insulating film, method of forming insulating film using the composition and electronic parts having the insulating film produced thereby
App 20030010961 - Fukuyama, Shun-Ichi ;   et al.
2003-01-16

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