INOUE; Hiroharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for INOUE; Hiroharu.The latest application filed is for "resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board".

Company Profile

7.22.38

INOUE; Hiroharu - Osaka JP
Inoue; Hiroharu - Hirakata JP
Inoue; Hiroharu - Hirakata-shi JP
Inoue; Hiroharu - Fukaya-shi JP
Inoue; Hiroharu - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin Composition, Prepreg, Film With Resin, Metal Foil With Resin, Metal-clad Laminate, And Wiring Board App 20220259424 - SAITO; Hirosuke ; et al.	2022-08-18
Resin Composition, Prepreg, Film With Resin, Metal Foil With Resin, Metal-clad Laminate, And Wiring Board App 20220259363 - SAITO; Hirosuke ; et al.	2022-08-18
Prepreg, metal-clad laminate and printed wiring board Grant 11,407,869 - Kashihara , et al. August 9, 2	2022-08-09
Resin Composition, Prepreg Obtained Using Same, Resin-coated Film, Resin-coated Metal Foil, Metal-clad Laminate, And Wiring Board App 20220243013 - UMEHARA; Hiroaki ; et al.	2022-08-04
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition Grant 11,365,274 - Umehara , et al. June 21, 2	2022-06-21
Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board Grant 11,234,329 - Watanabe , et al. January 25, 2	2022-01-25
Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board Grant 11,066,548 - Umehara , et al. July 20, 2	2021-07-20
Prepreg, metal-clad laminated board, and printed wiring board Grant 11,059,260 - Kashihara , et al. July 13, 2	2021-07-13
Prepreg, Substrate, Metal-clad Laminate, Semiconductor Package, And Printed Circuit Board App 20210092835 - WATANABE; Rihoko ; et al.	2021-03-25
Polyphenylene Ether Resin Composition, Prepreg Using Same, Film With Resin, Metal Foil With Resin, Metal-clad Laminate And Wiring Board App 20210061996 - UMEHARA; Hiroaki ; et al.	2021-03-04
Resin Composition, And Prepreg, Resin-coated Film, Resin-coated Metal Foil, Metal-clad Laminate, And Wiring Board Each Obtained Using Said Resin Composition App 20210054197 - UMEHARA; Hiroaki ; et al.	2021-02-25
Resin Composition, And Prepreg, Resin-coated Film, Resin-coated Metal Foil, Metal-clad Laminate, And Wiring Board Each Obtained Using Said Resin Composition App 20210032424 - UMEHARA; Hiroaki ; et al.	2021-02-04
Resin Composition, And Prepreg, Resin-coated Film, Resin-coated Metal Foil, Metal-clad Laminate, And Wiring Board Each Obtained Using Said Resin Composition App 20210017317 - UMEHARA; Hiroaki ; et al.	2021-01-21
Polyphenylene Ether Resin Composition, Prepreg, Metal-clad Laminate, And Printed Wiring Board App 20200283615 - UMEHARA; Hiroaki ; et al.	2020-09-10
Poly(phenylene Ether) Resin Composition, And Prepreg, Metal-clad Laminate, And Wiring Board Each Obtained Using Same App 20200181403 - SUZUKI; Fumito ; et al.	2020-06-11
Prepreg, Metal-clad Laminate And Printed Wiring Board App 20200087474 - KASHIHARA; Keiko ; et al.	2020-03-19
Metal foil with resin, and metal-clad laminate and circuit board using same Grant 10,543,661 - Yamauchi , et al. Ja	2020-01-28
Prepreg, Metal-clad Laminated Board, And Printed Wiring Board App 20190263087 - KASHIHARA; Keiko ; et al.	2019-08-29
Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material Grant 10,371,612 - Kashihara , et al.	2019-08-06
Polyphenylene Ether Resin Composition, Prepreg, Metal-clad Laminate, And Printed Wiring Board App 20180312683 - UMEHARA; HIROAKI ; et al.	2018-11-01
Prepreg, Metal-clad Laminated Plate, Wiring Board, And Method For Measuring Thermal Stress Of Wiring Board Material App 20180275031 - KASHIHARA; KEIKO ; et al.	2018-09-27
Metal Foil With Resin, And Metal-clad Laminate And Circuit Board Using Same App 20180250916 - YAMAUCHI; AKIHIRO ; et al.	2018-09-06
Metal-clad laminate and printed wiring board Grant 10,009,997 - Inoue , et al. June 26, 2	2018-06-26
Prepreg, metal-clad laminated plate and printed wiring board Grant 9,894,761 - Hoshi , et al. February 13, 2	2018-02-13
Metal-clad laminate and printed wiring board Grant 9,795,030 - Inoue , et al. October 17, 2	2017-10-17
Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board Grant 9,736,935 - Inoue , et al. August 15, 2	2017-08-15
Metal-clad Laminate And Printed Wiring Board App 20170196082 - INOUE; Hiroharu ; et al.	2017-07-06
Metal-clad laminate and printed wiring board Grant 9,661,749 - Inoue , et al. May 23, 2	2017-05-23
Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board Grant 9,585,248 - Inoue , et al. February 28, 2	2017-02-28
Prepreg, metal-clad laminate, and printed wiring board Grant 9,578,734 - Inoue , et al. February 21, 2	2017-02-21
Prepreg, Metal-clad Laminated Plate And Printed Wiring Board App 20160366761 - HOSHI; TAKASHI ; et al.	2016-12-15
Metal-clad laminate and printed wiring board Grant 9,516,746 - Kishino , et al. December 6, 2	2016-12-06
Metal-clad laminate and printed wiring board Grant 9,480,148 - Inoue , et al. October 25, 2	2016-10-25
Poly(phenylene Ether) Resin Composition, Prepreg, Metal-clad Laminate, And Printed-wiring Board App 20160168378 - UMEHARA; HIROAKI ; et al.	2016-06-16
Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminated Board And Printed Wiring Board App 20160143135 - INOUE; Hiroharu ; et al.	2016-05-19
Prepreg, Metal-clad Laminate, And Printed Wiring Board App 20160090457 - UMEHARA; HIROAKI ; et al.	2016-03-31
Prepreg, Metal-clad Laminate, And Printed Wiring Board App 20150282302 - HOSHI; Takashi ; et al.	2015-10-01
Prepreg, Metal-clad Laminate And Printed Circuit Board App 20150259489 - UMEHARA; Hiroaki ; et al.	2015-09-17
Prepreg, metal-clad laminate, and printed wiring board Grant 9,102,850 - Inoue , et al. August 11, 2	2015-08-11
Prepreg, Metal-clad Laminate, And Printed Wiring Board App 20150075852 - Inoue; Hiroharu ; et al.	2015-03-19
Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminated Board And Printed Wiring Board App 20150037589 - INOUE; Hiroharu ; et al.	2015-02-05
Metal-plated Laminated Board, And Printed Wiring Board App 20140374142 - Inoue; Hiroharu ; et al.	2014-12-25
Prepreg, Metal-clad Laminate, And Printed Wiring Board App 20140367150 - Inoue; Hiroharu ; et al.	2014-12-18
Metal-clad Laminate And Printed Wiring Board App 20140311781 - Kishino; Koji ; et al.	2014-10-23
Metal-clad Laminate And Printed Wiring Board App 20140116764 - Inoue; Hiroharu ; et al.	2014-05-01
Metal-clad Laminate And Printed Wiring Board App 20130319735 - Inoue; Hiroharu ; et al.	2013-12-05
Poly (phenylene ether) resin composition, prepreg, and laminated sheet Grant 7,838,576 - Inoue , et al. November 23, 2	2010-11-23
Flame-retardant Resin Composition, And Prepreg, Resin Sheet And Molded Article Using The Same App 20100233486 - Inoue; Hiroharu ; et al.	2010-09-16
Poly (phenylene Ether) Resin Composition, Prepreg, And Laminated Sheet App 20080254257 - Inoue; Hiroharu ; et al.	2008-10-16
Poly (phenylene ether) resin composition, prepreg, and laminated sheet Grant 7,413,791 - Inoue , et al. August 19, 2	2008-08-19
Liquid Crystal Display Device App 20080055524 - Manabe; Atsuyuki ; et al.	2008-03-06
Array substrate and method of manufacturing the same App 20070221923 - Obi; Masaki ; et al.	2007-09-27
Liquid Crystal Display Device App 20070182888 - INOUE; Hiroharu ; et al.	2007-08-09
Array substrate and liquid crystal display panel App 20070121052 - Inoue; Hiroharu ; et al.	2007-05-31
Liquid crystal display device App 20070040964 - Shohara; Kiyoshi ; et al.	2007-02-22
Poly (phenylene ether) resin composition, prepreg, and laminated sheet App 20040146692 - Inoue, Hiroharu ; et al.	2004-07-29
Soluble copolyimide from 9,9-bis (4-amino phenyl) fluorene Grant 4,845,185 - Teramoto , et al. July 4, 1	1989-07-04

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