loadpatents
name:-0.0401611328125
name:-0.033799886703491
name:-0.0071220397949219
Inoue; Fumio Patent Filings

Inoue; Fumio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Inoue; Fumio.The latest application filed is for "headlamp control device".

Company Profile
5.31.26
  • Inoue; Fumio - Okazaki JP
  • INOUE; Fumio - Okazaki-shi JP
  • INOUE; Fumio - Akashi JP
  • INOUE; Fumio - Kobe-shi JP
  • Inoue; Fumio - Kobe JP
  • Inoue; Fumio - Tsukuba JP
  • Inoue; Fumio - Akashi-shi JP
  • Inoue; Fumio - Ibaraki JP
  • Inoue; Fumio - Yokohama JP
  • Inoue; Fumio - Tsukuba-shi JP
  • Inoue; Fumio - Tokyo JP
  • Inoue, Fumio - Yokohama-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Headlamp control device
Grant 11,214,190 - Sawada , et al. January 4, 2
2022-01-04
Headlamp Control Device
App 20210387567 - SAWADA; Tomonari ;   et al.
2021-12-16
Gene Analysis Method, Gene Analysis Apparatus, Management Server, Gene Analysis System, Program, And Storage Medium
App 20200350035 - INOUE; Fumio ;   et al.
2020-11-05
Sample Processing Apparatus
App 20200124629 - YAMAMOTO; Junzo ;   et al.
2020-04-23
Management method for a sample processing apparatus
Grant 10,545,159 - Yamamoto , et al. Ja
2020-01-28
Analysis Method, Information Processing Apparatus, And Non-transitory Computer Readable Medium
App 20200020418 - WATANABE; Reiko ;   et al.
2020-01-16
Sequence Analysis Method, Sequence Analysis Apparatus, Reference Sequence Generation Method, Reference Sequence Generation Appar
App 20190156914 - KATO; Mamoru ;   et al.
2019-05-23
Management Method For A Sample Processing Apparatus
App 20170059598 - YAMAMOTO; Junzo ;   et al.
2017-03-02
Sample processing apparatus management system, sample processing apparatus and management apparatus, and management method
Grant 9,494,610 - Yamamoto , et al. November 15, 2
2016-11-15
Analyzer and method of analyzing
Grant 9,395,378 - Mizumoto , et al. July 19, 2
2016-07-19
Sample analyzer, sample information processing apparatus, and sample analysis method
Grant 9,075,043 - Mizumoto , et al. July 7, 2
2015-07-07
Analyzer And Method Of Analyzing
App 20150128730 - MIZUMOTO; Toru ;   et al.
2015-05-14
Analyzer and method of analyzing
Grant 8,967,459 - Mizumoto , et al. March 3, 2
2015-03-03
Method for surface treatment of copper and copper
Grant 8,809,696 - Yamashita , et al. August 19, 2
2014-08-19
Sample Analyzer, Sample Information Processing Apparatus, And Sample Analysis Method
App 20140024072 - MIZUMOTO; Toru ;   et al.
2014-01-23
Analyzer And Method Of Analyzing
App 20130292464 - MIZUMOTO; Toru ;   et al.
2013-11-07
Analyzer and method of analyzing
Grant 8,474,692 - Mizumoto , et al. July 2, 2
2013-07-02
Sample Processing Apparatus Management System, Sample Processing Apparatus And Management Apparatus, And Management Method
App 20130139616 - YAMAMOTO; Junzo ;   et al.
2013-06-06
Analyzer And Method Of Analyzing
App 20120074214 - Mizumoto; Toru ;   et al.
2012-03-29
Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
Grant 8,028,402 - Nakamura , et al. October 4, 2
2011-10-04
Method For Surface Treatment Of Copper And Copper
App 20110147072 - Yamashita; Tomoaki ;   et al.
2011-06-23
Method of treating the surface of copper and copper
Grant 7,588,835 - Yamashita , et al. September 15, 2
2009-09-15
Image display system
Grant 7,486,334 - Masuda , et al. February 3, 2
2009-02-03
Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
App 20090008141 - Nakamura; Hidehiro ;   et al.
2009-01-08
Connection Board, And Multi-layer Wiring Board, Substrate For Semiconductor Package And Semiconductor Package Using Connection Board, And Manufacturing Method Thereof
App 20080289868 - Nakamura; Hidehiro ;   et al.
2008-11-27
Method Of Treating The Surface Of Copper And Copper
App 20080096046 - Yamashita; Tomoaki ;   et al.
2008-04-24
Connection Board, And Multi-layer Wiring Board, Substrate For Semiconductor Package And Semiconductor Package Using Connection Board, And Manufacturing Method Thereof
App 20080010819 - NAKAMURA; Hidehiro ;   et al.
2008-01-17
Fabrication process of semiconductor package and semiconductor package
Grant 7,187,072 - Fukutomi , et al. March 6, 2
2007-03-06
Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them
App 20060162956 - Nakamura; Hidehiro ;   et al.
2006-07-27
Symbol illuminator of game machine
Grant 7,043,860 - Inoue May 16, 2
2006-05-16
Image output system capable of appropriately providing printing service for free or small change
Grant 6,917,440 - Kondo , et al. July 12, 2
2005-07-12
Image display system
App 20050001932 - Masuda, Kouzou ;   et al.
2005-01-06
Symbol illuminator of game machine
App 20040200102 - Inoue, Fumio
2004-10-14
Image display system
Grant 6,791,623 - Masuda , et al. September 14, 2
2004-09-14
Fabrication process of semiconductor package and semiconductor package
App 20040110319 - Fukutomi, Naoki ;   et al.
2004-06-10
Fabrication process of semiconductor package and semiconductor package
Grant 6,746,897 - Fukutomi , et al. June 8, 2
2004-06-08
Symbol display device for game machine
App 20040018869 - Inoue, Fumio
2004-01-29
Symbol display device for game machine
App 20030146571 - Inoue, Fumio
2003-08-07
Symbol displaying unit used for a game machine
App 20020180147 - Inoue, Fumio
2002-12-05
Fabrication process of semiconductor package and semiconductor package
App 20020094606 - Fukutomi, Naoki ;   et al.
2002-07-18
Image output system capable of appropriately providing printing service for free or small charge
App 20020039193 - Kondo, Shoji ;   et al.
2002-04-04
Fabrication process of semiconductor package and semiconductor package
App 20020039808 - Fukutomi, Naoki ;   et al.
2002-04-04
Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them
Grant 6,331,729 - Yusa , et al. December 18, 2
2001-12-18
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package
Grant 6,236,108 - Sota , et al. May 22, 2
2001-05-22
Method of production of semiconductor device
Grant 6,223,429 - Kaneda , et al. May 1, 2
2001-05-01
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package
Grant 6,064,111 - Sota , et al. May 16, 2
2000-05-16
Fabrication process of semiconductor package and semiconductor package
Grant 5,976,912 - Fukutomi , et al. November 2, 1
1999-11-02
Liquid crystal Projection display
Grant 5,758,940 - Ogino , et al. June 2, 1
1998-06-02
Liquid crystal projection display
Grant 5,537,171 - Ogino , et al. July 16, 1
1996-07-16
Abrasive cloth dresser
Grant 5,421,768 - Fujiwara , et al. June 6, 1
1995-06-06
Mutiscreen display apparatus
Grant 5,396,257 - Someya , et al. March 7, 1
1995-03-07
Liquid crystal projection display
Grant 5,355,187 - Ogino , et al. October 11, 1
1994-10-11
Display device with matrix-arranged pixels having reduced number of vertical signal lines
Grant 5,151,689 - Kabuto , et al. September 29, 1
1992-09-29
Beam-indexing color picture tube arrangement
Grant 4,507,585 - Inoue , et al. March 26, 1
1985-03-26

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