Inomata; Teruji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Inomata; Teruji.The latest application filed is for "manufacturing method of semiconductor device, and semiconductor device".

Company Profile

0.4.10

Inomata; Teruji - Kanagawa JP
INOMATA; Teruji - Kawasaki JP
Inomata; Teruji - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing method of semiconductor device, and semiconductor device App 20100140796 - Ishido; Kiminori ; et al.	2010-06-10
Process for manufacturing semiconductor device and semiconductor device manufactured by such process App 20090250826 - Inomata; Teruji	2009-10-08
Semiconductor device having a heatsink plate with bored portions Grant 7,554,191 - Inomata , et al. June 30, 2	2009-06-30
Method Of Manufacturing Semiconductor Device Having A Heat Sink With A Bored Portion App 20090023252 - Inomata; Teruji ; et al.	2009-01-22
Semiconductor Device Including Wiring Substrate Having Element Mounting Surface Coated By Resin Layer App 20080251913 - INOMATA; Teruji	2008-10-16
Bonding method and bonding apparatus Grant 7,370,786 - Kurita , et al. May 13, 2	2008-05-13
Method of manufacturing an electronic component App 20070228115 - Inomata; Teruji ; et al.	2007-10-04
Semiconductor device and method of manufacturing the same App 20070152322 - Inomata; Teruji ; et al.	2007-07-05
Bonding method and bonding apparatus App 20060011706 - Kurita; Yoichiro ; et al.	2006-01-19
Bonding method and bonding apparatus Grant 6,932,262 - Kurita , et al. August 23, 2	2005-08-23
Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method Grant 6,814,274 - Kurita , et al. November 9, 2	2004-11-09
Bonding method and bonding apparatus App 20040214406 - Kurita, Yoichiro ; et al.	2004-10-28
Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method App 20030010812 - Kurita, Yoichiro ; et al.	2003-01-16
Manufacturing method of semiconductor device App 20020106903 - Kurita, Yoichiro ; et al.	2002-08-08

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