Inomata; Sumitomo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Inomata; Sumitomo.The latest application filed is for "high hardness material working method and working apparatus".

Company Profile

0.7.8

Inomata; Sumitomo - Toyota N/A JP
INOMATA; Sumitomo - Toyota-city JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus Grant 8,758,087 - Koutake , et al. June 24, 2	2014-06-24
High Hardness Material Working Method And Working Apparatus App 20130217305 - KOUTAKE; Kyohei ; et al.	2013-08-22
Wafer Processing Method, Wafer Polishing Apparatus, And Ingot Slicing Apparatus App 20110294403 - KOUTAKE; Kyohei ; et al.	2011-12-01
Method For Forming Periodic Structure And Fuel Injection System Having The Periodic Structure App 20110147493 - MITSUOKA; Yoshihito ; et al.	2011-06-23
Semiconductor device and method for producing the same by dicing Grant 7,091,109 - Fujii , et al. August 15, 2	2006-08-15
Method and device for removing burr by high-density energy beam App 20060065648 - Kameyama; Michio ; et al.	2006-03-30
Laser beam machining equipment and method for machining by using laser beam App 20050230370 - Kameyama, Michio ; et al.	2005-10-20
Semiconductor device and method for producing the same by dicing App 20040259330 - Fujii, Tetsuo ; et al.	2004-12-23
High density energy beam machining method and apparatus for the same Grant 6,495,796 - Fukaya , et al. December 17, 2	2002-12-17
Semiconductor device produced by dicing Grant 6,429,506 - Fujii , et al. August 6, 2	2002-08-06
Semiconductor device and method for producing the same by dicing App 20020093076 - Fujii, Tetsuo ; et al.	2002-07-18
High density energy beam machining method and apparatus for the same App 20020023905 - Fukaya, Terukazu ; et al.	2002-02-28
Semiconductor device with a protective sheet to affix a semiconductor chip Grant 6,255,741 - Yoshihara , et al. July 3, 2	2001-07-03
Method for manufacturing a semiconductor device Grant 5,824,177 - Yoshihara , et al. October 20, 1	1998-10-20

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