INNOPAD, INC.

Patent Applications and Registrations

Patent applications and USPTO patent grants for INNOPAD, INC..The latest application filed is for "chemical-mechanical planarization pad including patterned structural domains".

Company Profile

0.11.15

INNOPAD, INC. - Wilminton MA US
Innopad, Inc. - Wilmington MA
INNOPAD, INC. - Peabody MA
INNOPAD, INC. - Peadbody MA
INNOPAD, INC. - 6 Centennial Drive Peabody MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chemical-mechanical planarization pad including patterned structural domains Grant 9,162,341 - LeFevre , et al. October 20, 2	2015-10-20
Fabric containing non-crimped fibers and methods of manufacture Grant 8,546,260 - Hsu , et al. October 1, 2	2013-10-01
Chemical-mechanical Planarization Pad Including Patterned Structural Domains App 20130244548 - LEFEVRE; Paul ; et al.	2013-09-19
Method Of Manufacturing A Chemical Mechanical Planarization Pad App 20130205679 - ALDEBORGH; John Erik ; et al.	2013-08-15
Three-dimensional network in CMP pad Grant 8,491,360 - Lefevre , et al. July 23, 2	2013-07-23
Chemical-mechanical planarization pad including patterned structural domains Grant 8,435,099 - Lefevre , et al. May 7, 2	2013-05-07
Chemical-mechanical planarization pad Grant 8,430,721 - Hsu , et al. April 30, 2	2013-04-30
Polishing pad with controlled void formation Grant 8,377,351 - Lefevre , et al. February 19, 2	2013-02-19
Polishing Pad Having Micro-grooves On The Pad Surface App 20120178348 - HSU; Oscar K. ; et al.	2012-07-12
Chemical-mechanical planarization pad Grant 8,172,648 - Lefevre , et al. May 8, 2	2012-05-08
Method Of Grooving A Chemical-mechanical Planarization Pad App 20120073210 - LEFEVRE; Paul ; et al.	2012-03-29
Polishing pad having micro-grooves on the pad surface Grant 8,137,166 - Hsu , et al. March 20, 2	2012-03-20
Chemical-mechanical planarization pad having end point detection window Grant 7,985,121 - Lefevre , et al. July 26, 2	2011-07-26
Fabric Containing Non-crimped Fibers And Methods Of Manufacture App 20110171831 - Hsu; Oscar K. ; et al.	2011-07-14
Chemical-mechanical Planarization Pad Including Patterned Structural Domains App 20100221985 - LEFEVRE; Paul ; et al.	2010-09-02
Multi-layered Chemical-mechanical Planarization Pad App 20100221983 - LEFEVRE; Paul ; et al.	2010-09-02
Chemical Mechanical Planarization Pad With Void Network App 20090258588 - HSU; Oscar K. ; et al.	2009-10-15
Polishing Pad With Controlled Void Formation App 20090246504 - LEFEVRE; Paul ; et al.	2009-10-01
Chemical-mechanical Planarization Pad App 20090170413 - Hsu; Oscar K. ; et al.	2009-07-02
Chemical-mechanical Planarization Pad App 20090170410 - Hsu; Oscar K. ; et al.	2009-07-02
Chemical-Mechanical Planarization Pad Having End Point Detection Window App 20090142989 - LEFEVRE; Paul ; et al.	2009-06-04
Three-Dimensional Network in CMP Pad App 20090137121 - HSU; Oscar K. ; et al.	2009-05-28
Polishing pad Grant 7,534,163 - Vangsness , et al. May 19, 2	2009-05-19
Polishing pad Grant 7,357,704 - Vangsness , et al. April 15, 2	2008-04-15
Polishing Pad Having Micro-Grooves On The Pad Surface App 20080085661 - HSU; Oscar K. ; et al.	2008-04-10

Company Registrations

SEC

0001380301

InnoPad Inc of DELAWARE

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