INGERLY; Doug

Patent Applications and Registrations

Patent applications and USPTO patent grants for INGERLY; Doug.The latest application filed is for "device, system and method for providing inductor structures".

Company Profile

7.6.10

INGERLY; Doug - Portland OR
INGERLY; DOUG - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device, System And Method For Providing Inductor Structures App 20220302051 - GOMES; Wilfred ; et al.	2022-09-22
Recoiled metal thin film for 3D inductor with tunable core Grant 11,444,148 - Kim , et al. September 13, 2	2022-09-13
Device, system and method for providing inductor structures Grant 11,387,198 - Gomes , et al. July 12, 2	2022-07-12
Transistors with back-side contacts to create three dimensional memory and logic Grant 11,335,686 - Gomes , et al. May 17, 2	2022-05-17
Hyperchip App 20210225808 - BOHR; Mark T. ; et al.	2021-07-22
Integrated Circuit Device Structures And Double-sided Electrical Testing App 20210175124 - RAO; Valluri R. ; et al.	2021-06-10
Hyperchip Grant 11,024,601 - Bohr , et al. June 1, 2	2021-06-01
Transistors With Back-side Contacts To Create Three Dimensional Memory And Logic App 20210134802 - Gomes; Wilfred ; et al.	2021-05-06
Package On Active Silicon Semiconductor Packages App 20210013188 - Gomes; Wilfred ; et al.	2021-01-14
Integrated circuit structures Grant 10,872,820 - Block , et al. December 22, 2	2020-12-22
Device, System And Method For Providing Inductor Structures App 20200258852 - A1	2020-08-13
Recoiled Metal Thin Film For 3d Inductor With Tunable Core App 20200194540 - KIM; Gwang-Soo ; et al.	2020-06-18
Hyperchip App 20200066679 - BOHR; Mark T. ; et al.	2020-02-27
Integrated Circuit Device Structures And Double-sided Fabrication Techniques App 20200035560 - BLOCK; Bruce ; et al.	2020-01-30
Polymer interlayer dielectric and passivation materials for a microelectronic device Grant 8,154,121 - Shah , et al. April 10, 2	2012-04-10
Polymer Interlayer Dielectric And Passivation Materials For A Microelectronic Device App 20090212421 - Shah; Kunal ; et al.	2009-08-27

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