Infra+
Patent Applications and Registrations
Patent applications and USPTO patent grants for Infra+.The latest application filed is for "connector-mounting assembly".
- Infra+ - Les Roses FR
- INFRA+ -
- Infra+ - L'Hay les Roses FR
| Patent | Date |
|---|---|
| Connector-mounting assembly Grant 6,848,854 - Masse February 1, 2 | 2005-02-01 |
| Connector-mounting assembly App 20020171339 - Masse, Dominique | 2002-11-21 |
| Low-voltage male connector Grant 6,270,358 - Nozick August 7, 2 | 2001-08-07 |
| Terminal strip with flexible labelling facility Grant 5,419,715 - Laveissiere May 30, 1 | 1995-05-30 |
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