Infantolino; William
Patent Applications and Registrations
Patent applications and USPTO patent grants for Infantolino; William.The latest application filed is for "chip carrier with optimized circuitization pattern".
- Infantolino; William - Vestal NY
| Patent | Date |
|---|---|
| Electronic package with optimized circuitization pattern Grant 7,088,008 - Alcoe , et al. August 8, 2 | 2006-08-08 |
| Method and packaging structure for optimizing warpage of flip chip organic packages Grant 7,026,706 - Infantolino , et al. April 11, 2 | 2006-04-11 |
| Wafer with semiconductor chips mounted thereon Grant 6,967,389 - Infantolino , et al. November 22, 2 | 2005-11-22 |
| Land grid array stiffener for use with flexible chip carriers Grant 6,905,961 - Caletka , et al. June 14, 2 | 2005-06-14 |
| Chip carrier with optimized circuitization pattern App 20040183211 - Alcoe, David J. ; et al. | 2004-09-23 |
| Method and packaging structure for optimizing warpage of flip chip organic packages App 20040155339 - Infantolino, William ; et al. | 2004-08-12 |
| Wafer with semiconductor chips mounted thereon App 20040135245 - Infantolino, William ; et al. | 2004-07-15 |
| Semiconductor chip module and method of manufacture of same Grant 6,759,270 - Infantolino , et al. July 6, 2 | 2004-07-06 |
| Semiconductor chip module and method of manufacture of same Grant 6,756,662 - Infantolino , et al. June 29, 2 | 2004-06-29 |
| Method and packaging structure for optimizing warpage of flip chip organic packages Grant 6,747,331 - Infantolino , et al. June 8, 2 | 2004-06-08 |
| Semiconductor Chip Module And Method Of Manufacture Of Same App 20040056347 - Infantolino, William ; et al. | 2004-03-25 |
| Semiconductor chip module and method of manufacture of same App 20040058474 - Infantolino, William ; et al. | 2004-03-25 |
| Method and packaging structure for optimizing warpage of flip chip organic packages App 20040012086 - Infantolino, William ; et al. | 2004-01-22 |
| Land grid array stiffener for use with flexible chip carriers App 20030090000 - Caletka, David Vincent ; et al. | 2003-05-15 |
| Land grid array stiffener use with flexible chip carriers App 20020180061 - Caletka, David Vincent ; et al. | 2002-12-05 |
| Dual purpose ribbon cable Grant 6,433,283 - Brodsky , et al. August 13, 2 | 2002-08-13 |
| Dual purpose ribbon cable App 20010020541 - Brodsky, William L. ; et al. | 2001-09-13 |
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