Indyk; Richard F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Indyk; Richard F..The latest application filed is for "polygon integrated circuit (ic) packaging".

Company Profile

2.20.17

Indyk; Richard F. - Saratoga Springs NY
Indyk; Richard F. - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polygon integrated circuit (IC) packaging Grant 11,410,894 - Arvin , et al. August 9, 2	2022-08-09
Polygon Integrated Circuit (ic) Packaging App 20210074599 - Arvin; Charles L. ; et al.	2021-03-11
Stress-resilient chip structure and dicing process Grant 10,211,175 - Indyk , et al. Feb	2019-02-19
Edge trim processes and resultant structures Grant 10,134,577 - Indyk , et al. November 20, 2	2018-11-20
Dicing channels for glass interposers Grant 10,090,255 - Hedrick , et al. October 2, 2	2018-10-02
Structure for establishing interconnects in packages using thin interposers Grant 10,002,835 - Fasano , et al. June 19, 2	2018-06-19
Dicing Channels For Glass Interposers App 20170221837 - Hedrick; Brittany L. ; et al.	2017-08-03
Method And Structure For Establishing Interconnects In Packages Using Thin Interposers App 20170148737 - FASANO; Benjamin V. ; et al.	2017-05-25
Method for establishing interconnects in packages using thin interposers Grant 9,607,973 - Fasano , et al. March 28, 2	2017-03-28
Edge Trim Processes And Resultant Structures App 20160343564 - INDYK; Richard F. ; et al.	2016-11-24
Stress-resilient Chip Structure And Dicing Process App 20150001714 - Indyk; Richard F. ; et al.	2015-01-01
Stress-resilient Chip Structure And Dicing Process App 20140151879 - Indyk; Richard F. ; et al.	2014-06-05
Wafer dicing employing edge region underfill removal Grant 8,652,941 - Indyk , et al. February 18, 2	2014-02-18
Wafer Dicing Employing Edge Region Underfill Removal App 20130149841 - Indyk; Richard F. ; et al.	2013-06-13
High tin solder etching solution Grant 7,897,059 - Indyk , et al. March 1, 2	2011-03-01
Method and structure to improve thermal dissipation from semiconductor devices Grant 7,724,527 - Coico , et al. May 25, 2	2010-05-25
High Tin Solder Etching Solution App 20090120999 - Indyk; Richard F. ; et al.	2009-05-14
Method and structure to improve thermal dissipation from semiconductor devices Grant 7,468,886 - Coico , et al. December 23, 2	2008-12-23
Method And Structure To Improve Thermal Dissipation From Semiconductor Devices App 20080310117 - Coico; Patrick A. ; et al.	2008-12-18
Method And Structure To Improve Thermal Dissipation From Semiconductor Devices App 20080218971 - Coico; Patrick A. ; et al.	2008-09-11
Surface Treatments For Underfill Control App 20070099346 - Farooq; Mukta ; et al.	2007-05-03
Method to produce low strength temporary solder joints Grant 7,087,513 - Fasano , et al. August 8, 2	2006-08-08
Method To Produce Low Strength Temporary Solder Joints App 20060088997 - Fasano; Benjamin V. ; et al.	2006-04-27
Temporary chip attach method using reworkable conductive adhesive interconnections App 20060014309 - Sachdev; Krishna Gandhi ; et al.	2006-01-19
Method and apparatus to form a reworkable seal on an electronic module Grant 6,955,543 - Messina , et al. October 18, 2	2005-10-18
Method And Apparatus To Form A Reworkable Seal On An Electronic Module App 20050037640 - Messina, Gaetano P. ; et al.	2005-02-17
Method to produce pedestal features in constrained sintered substrates Grant 6,835,260 - Fasano , et al. December 28, 2	2004-12-28
Method of selective plating on a substrate Grant 6,823,585 - LaPlante , et al. November 30, 2	2004-11-30
Selective plating using dual lift-off mask App 20040187303 - LaPlante, Mark J. ; et al.	2004-09-30
Method to produce pedestal features in constrained sintered substrates App 20040065401 - Fasano, Benjamin V. ; et al.	2004-04-08
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer Grant 6,597,058 - Natarajan , et al. July 22, 2	2003-07-22
Multilayer ceramic substrate with anchored pad Grant 6,312,791 - Fasano , et al. November 6, 2	2001-11-06
Method for producing ceramic surfaces with easily removable contact sheets Grant 6,139,666 - Fasano , et al. October 31, 2	2000-10-31
Ceramic substrate having a sealed layer Grant 6,136,419 - Fasano , et al. October 24, 2	2000-10-24
Structure to reduce stress in multilayer ceramic substrates Grant 5,700,549 - Garant , et al. December 23, 1	1997-12-23

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