| Patent | Date |
|---|
Build Plate With Thermally Decomposing Top Surface For Facile Release Of 3d Printed Objects
App 20220266344 - Socha; David P. ; et al. | 2022-08-25 |
Thermally Decomposing Build Plate With Casting Mold For Facile Release Of 3d Printed Objects
App 20220266343 - Socha; David P. ; et al. | 2022-08-25 |
High reliability lead-free solder alloys for harsh environment electronics applications
Grant 11,413,709 - Liu , et al. August 16, 2 | 2022-08-16 |
Low Temperature Melting And Mid Temperature Melting Lead-free Solder Paste With Mixed Solder Alloy Powders
App 20220184749 - Zhang; Hongwen ; et al. | 2022-06-16 |
Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
Grant 11,267,080 - Zhang , et al. March 8, 2 | 2022-03-08 |
High reliability lead-free solder alloys for harsh environment electronics applications
Grant 11,229,979 - Liu , et al. January 25, 2 | 2022-01-25 |
Lead-free Solder Paste With Mixed Solder Powders For High Temperature Applications
App 20210339344 - Zhang; Hongwen ; et al. | 2021-11-04 |
Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger
Grant 10,943,795 - Berntson , et al. March 9, 2 | 2021-03-09 |
Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger
Grant 10,943,796 - Berntson , et al. March 9, 2 | 2021-03-09 |
Thermally Decomposing Build Plate For Facile Release Of 3d Printed Objects
App 20210053122 - Socha; David P. ; et al. | 2021-02-25 |
Ge-doped Ausn Solder Alloys
App 20210047710 - Wu; Joseph C. ; et al. | 2021-02-18 |
Hybrid high temperature lead-free solder preform
Grant 10,888,958 - Zhang , et al. January 12, 2 | 2021-01-12 |
Burn-in preform and method of making the same
Grant 10,838,002 - Gross , et al. November 17, 2 | 2020-11-17 |
Low Temperature Melting And Mid Temperature Melting Lead-free Solder Paste With Mixed Solder Alloy Powders
App 20200353572 - Zhang; Hongwen ; et al. | 2020-11-12 |
Solder Preform With Internal Flux Core Including Thermochromic Indicator
App 20200346307 - Merritt; Craig K. ; et al. | 2020-11-05 |
Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material
Grant 10,813,228 - Kresge , et al. October 20, 2 | 2020-10-20 |
High Reliability Leadfree Solder Alloys For Harsh Service Conditions
App 20200269360 - Geng; Jie ; et al. | 2020-08-27 |
Fluxes effective in suppressing non-wet-open at BGA assembly
Grant 10,756,039 - Zhou , et al. A | 2020-08-25 |
Lead-free Solder Paste For Thermal Via Filling
App 20200230750 - Lee; Ning-Cheng ; et al. | 2020-07-23 |
Lead-free Solder Paste As Thermal Interface Material
App 20200235033 - Lee; Ning-Cheng ; et al. | 2020-07-23 |
Apparatus And Methods For Creating A Thermal Interface Bond Between A Semiconductor Die And A Passive Heat Exchanger
App 20200126813 - Berntson; Ross B. ; et al. | 2020-04-23 |
Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger
Grant 10,607,857 - Berntson , et al. | 2020-03-31 |
High Reliability Lead-free Solder Alloys For Harsh Environment Electronics Applications
App 20200094353 - Liu; Weiping ; et al. | 2020-03-26 |
Snbi And Snin Solder Alloys
App 20200070287 - Mutuku; Francis M. ; et al. | 2020-03-05 |
Voiding control using solid solder preforms embedded in solder paste
Grant 10,537,030 - Wei , et al. Ja | 2020-01-14 |
Preventing Post Reflow Interconnect Failures In Vippo Solder Joints Via Utilization Of Adhesive Material
App 20190394883 - Kresge; Lee C. ; et al. | 2019-12-26 |
Fluxes Effective In Suppressing Non-wet-open At Bga Assembly
App 20190371752 - ZHOU; FENGYING ; et al. | 2019-12-05 |
Hybrid High Temperature Lead-free Solder Preform
App 20190366486 - ZHANG; HONGWEN ; et al. | 2019-12-05 |
Hybrid lead-free solder wire
Grant 10,328,533 - Zhang , et al. | 2019-06-25 |
Apparatus And Methods For Creating A Thermal Interface Bond Between A Semiconductor Die And A Passive Heat Exchanger
App 20190172727 - BERNTSON; ROSS B. ; et al. | 2019-06-06 |
Apparatus And Methods For Creating A Thermal Interface Bond Between A Semiconductor Die And A Passive Heat Exchanger
App 20190172726 - BERNTSON; ROSS B. ; et al. | 2019-06-06 |
Burn-in Preform And Method Of Making The Same
App 20190128953 - GROSS; THOMAS R. ; et al. | 2019-05-02 |
Solder Ribbon With Embedded Mesh For Improved Reliability Of Semiconductor Die To Substrate Attachment
App 20190030653 - Homer; Seth ; et al. | 2019-01-31 |
Solder Ribbon With Embedded Mesh For Improved Reliability Of Semiconductor Die To Substrate Attachment
App 20180361518 - Homer; Seth ; et al. | 2018-12-20 |
Mixed alloy solder paste
Grant 10,118,260 - Zhang , et al. November 6, 2 | 2018-11-06 |
Materials having increased mobility after heating
Grant 10,010,981 - Lee , et al. July 3, 2 | 2018-07-03 |
Hybrid Lead-free Solder Wire
App 20180029170 - ZHANG; Hongwen ; et al. | 2018-02-01 |
Nanomicrocrystallite paste for pressureless sintering
Grant 9,875,983 - Chen , et al. January 23, 2 | 2018-01-23 |
Tin-indium Based Low Temperature Solder Alloy
App 20170373034 - Luo; Jianguo ; et al. | 2017-12-28 |
Nanomicrocrystallite Paste For Pressureless Sintering
App 20170317046 - Chen; Sihai ; et al. | 2017-11-02 |
Hybrid lead-free solder wire
Grant 9,802,274 - Zhang , et al. October 31, 2 | 2017-10-31 |
Hybrid Lead-free Solder Wire
App 20170266765 - ZHANG; HONGWEN ; et al. | 2017-09-21 |
Spacer Particles For Bond Line Thickness Control In Sintering Pastes
App 20170271294 - Chen; Sihai ; et al. | 2017-09-21 |
Tin-indium based low temperature solder alloy
Grant 9,741,676 - Luo , et al. August 22, 2 | 2017-08-22 |
Capillary Block
App 20170203393 - Ross; Jordan Peter ; et al. | 2017-07-20 |
Capillary Block
App 20170203380 - Ross; Jordan Peter ; et al. | 2017-07-20 |
Mixed alloy solder paste
Grant 9,636,784 - Zhang , et al. May 2, 2 | 2017-05-02 |
High Reliability Lead-free Solder Alloys For Harsh Environment Electronics Applications
App 20160325384 - Liu; Weiping ; et al. | 2016-11-10 |
Low void solder joint for multiple reflow applications
Grant 9,468,136 - Ross , et al. October 11, 2 | 2016-10-11 |
Voiding Control Using Solid Solder Preforms Embedded In Solder Paste
App 20160057869 - Wei; Zhenxi ; et al. | 2016-02-25 |
Lead-free solder alloys and solder joints thereof with improved drop impact resistance
Grant 9,260,768 - Liu , et al. February 16, 2 | 2016-02-16 |
MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
Grant 9,175,368 - Liu , et al. November 3, 2 | 2015-11-03 |
Methods And Compositions For Forming Solder Bumps On A Substrate With Radiation Curable Or Thermal Curable Solder Flux
App 20150258638 - Hu; Ming ; et al. | 2015-09-17 |
Mixed Alloy Solder Paste
App 20150246417 - ZHANG; HONGWEN ; et al. | 2015-09-03 |
Heat dissipating paint with high thermal radiating capability
Grant 9,120,930 - Chen , et al. September 1, 2 | 2015-09-01 |
Mixed Alloy Solder Paste
App 20150224602 - Zhang; Hongwen ; et al. | 2015-08-13 |
Mixed alloy solder paste
Grant 9,017,446 - Zhang , et al. April 28, 2 | 2015-04-28 |
Low void solder joint for multiple reflow applications
Grant 9,010,616 - Ross , et al. April 21, 2 | 2015-04-21 |
Low Void Solder Joint For Multiple Reflow Applications
App 20140193658 - Ross; Jordan Peter ; et al. | 2014-07-10 |
Heat Dissipating Paint With High Thermal Radiating Capability
App 20130112109 - Chen; Sihai ; et al. | 2013-05-09 |
Composite solder alloy preform
Grant 8,348,139 - Liu , et al. January 8, 2 | 2013-01-08 |
Mn Doped Sn-base Solder Alloy And Solder Joints Thereof With Superior Drop Shock Reliability
App 20120328361 - LIU; WEIPING ; et al. | 2012-12-27 |
Solder preform
Grant 8,061,578 - Hartnett , et al. November 22, 2 | 2011-11-22 |
Technique for increasing the compliance of tin-indium solders
Grant 7,749,336 - Huang , et al. July 6, 2 | 2010-07-06 |
Technique for increasing the compliance of lead-free solders containing silver
Grant 7,749,340 - Huang , et al. July 6, 2 | 2010-07-06 |
Method for fabricating large dimension bonds using reactive multilayer joining
Grant 7,635,076 - Duckham , et al. December 22, 2 | 2009-12-22 |
Technique for forming a thermally conductive interface with patterned metal foil
Grant 7,593,228 - Jarrett , et al. September 22, 2 | 2009-09-22 |
Materials Having Increased Mobility After Heating
App 20090084469 - Lee; Ning-Cheng ; et al. | 2009-04-02 |
Alloy Compositions And Techniques For Reducing Intermetallic Compound Thickness And Oxidation Of Metals And Alloys
App 20070256761 - Hwang; Hong-Sik ; et al. | 2007-11-08 |
Lead-Free Solder Alloys And Solder Joints Thereof With Improved Drop Impact Resistance
App 20070134125 - Liu; Weiping ; et al. | 2007-06-14 |
Technique For Increasing The Compliance Of Lead-Free Solders Containing Silver
App 20070092396 - Huang; Benlih ; et al. | 2007-04-26 |
Technique For Forming A Thermally Conductive Interface With Patterned Metal Foil
App 20070091574 - JARRETT; ROBERT N. ; et al. | 2007-04-26 |
Low Melting Temperature Compliant Solders
App 20070071634 - Huang; Benlih ; et al. | 2007-03-29 |
Technique for increasing the compliance of tin-indium solders
App 20070048172 - Huang; Benlih ; et al. | 2007-03-01 |
Solder pastes for providing high elasticity, low rigidity solder joints
Grant 7,017,795 - Liu , et al. March 28, 2 | 2006-03-28 |
Integrated underfill process for bumped chip assembly
App 20050028361 - Yin, Wushing ; et al. | 2005-02-10 |
Anti-tombstoning solder alloys for surface mount applications
Grant 6,783,057 - Huang , et al. August 31, 2 | 2004-08-31 |
Method of applying no-flow underfill
Grant 6,677,179 - Yin , et al. January 13, 2 | 2004-01-13 |
Integrated void-free process for assembling a solder bumped chip
Grant 6,610,559 - Wang , et al. August 26, 2 | 2003-08-26 |
Anti-tombstoning solder alloys for surface mount applications
App 20020063147 - Huang, Benlih ; et al. | 2002-05-30 |
Lead-free alloy containing tin, silver and indium
Grant 5,580,520 - Slattery , et al. December 3, 1 | 1996-12-03 |
Lead-free alloy containing tin, zinc, indium and bismuth
Grant 5,455,004 - Slattery , et al. October 3, 1 | 1995-10-03 |
Lead-free alloy containing tin, silver and indium
Grant 5,256,370 - Slattery , et al. October 26, 1 | 1993-10-26 |
Fusible alloy containing bismuth, indium, lead, tin and gallium
Grant 5,248,476 - Slattery , et al. September 28, 1 | 1993-09-28 |
Integrated preforms
Grant 5,242,097 - Socha September 7, 1 | 1993-09-07 |
Lead-free alloy containing tin, zinc and indium
Grant 5,242,658 - Stevens , et al. September 7, 1 | 1993-09-07 |
Ceramic combined cover
Grant 4,746,583 - Falanga May 24, 1 | 1988-05-24 |
Corrosion resistant lid for semiconductor package
Grant 4,620,661 - Slatterly November 4, 1 | 1986-11-04 |
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