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name:-0.0044500827789307
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Inatani; Yuji Patent Filings

Inatani; Yuji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Inatani; Yuji.The latest application filed is for "wiring board assembly and method for producing same".

Company Profile
0.3.4
  • Inatani; Yuji - Sakura JP
  • INATANI; Yuji - Sakura-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wiring board assembly and method for producing same
Grant 10,237,971 - Takagi , et al.
2019-03-19
Wiring Board Assembly And Method For Producing Same
App 20160205765 - TAKAGI; Ryotaro ;   et al.
2016-07-14
Method of manufacturing multi-layer circuit board, and multi-layer circuit board
Grant 8,884,166 - Inatani November 11, 2
2014-11-11
Method Of Manufacturing Multi-layer Circuit Board, And Multi-layer Circuit Board
App 20130098662 - Inatani; Yuji
2013-04-25
Wiring board, multilayer wiring board, and method for manufacturing the same
Grant 7,926,175 - Ohara , et al. April 19, 2
2011-04-19
Wiring Board, Multilayer Wiring Board, And Method For Manufacturing The Same
App 20080016685 - OHARA; Toshihiko ;   et al.
2008-01-24
Wiring board, multilayer wiring board, and method for manufacturing the same
App 20060249833 - Ohara; Toshihiko ;   et al.
2006-11-09

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