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Patent applications and USPTO patent grants for Inatani; Yuji.The latest application filed is for "wiring board assembly and method for producing same".
Patent | Date |
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Wiring board assembly and method for producing same Grant 10,237,971 - Takagi , et al. | 2019-03-19 |
Wiring Board Assembly And Method For Producing Same App 20160205765 - TAKAGI; Ryotaro ;   et al. | 2016-07-14 |
Method of manufacturing multi-layer circuit board, and multi-layer circuit board Grant 8,884,166 - Inatani November 11, 2 | 2014-11-11 |
Method Of Manufacturing Multi-layer Circuit Board, And Multi-layer Circuit Board App 20130098662 - Inatani; Yuji | 2013-04-25 |
Wiring board, multilayer wiring board, and method for manufacturing the same Grant 7,926,175 - Ohara , et al. April 19, 2 | 2011-04-19 |
Wiring Board, Multilayer Wiring Board, And Method For Manufacturing The Same App 20080016685 - OHARA; Toshihiko ;   et al. | 2008-01-24 |
Wiring board, multilayer wiring board, and method for manufacturing the same App 20060249833 - Ohara; Toshihiko ;   et al. | 2006-11-09 |
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