loadpatents
name:-0.048292875289917
name:-0.044299125671387
name:-0.00082993507385254
Inao; Yoshihiro Patent Filings

Inao; Yoshihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Inao; Yoshihiro.The latest application filed is for "attachment method".

Company Profile
0.47.46
  • Inao; Yoshihiro - Kawasaki JP
  • Inao; Yoshihiro - Kawasaki-shi JP
  • Inao; Yoshihiro - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bonding method and bonding apparatus
Grant 9,962,915 - Miyanari , et al. May 8, 2
2018-05-08
Laminated body and method for separating laminated body
Grant 9,682,532 - Kubo , et al. June 20, 2
2017-06-20
Transport arm, transport apparatus and transport method
Grant 9,653,337 - Inao , et al. May 16, 2
2017-05-16
Supporting member separation method
Grant 9,627,235 - Iwata , et al. April 18, 2
2017-04-18
Attaching apparatus
Grant 9,548,232 - Katsuragawa , et al. January 17, 2
2017-01-17
Laminate and method for separating the same
Grant 9,492,986 - Inao , et al. November 15, 2
2016-11-15
Attachment method
Grant 9,484,238 - Inao , et al. November 1, 2
2016-11-01
Processing method and processing apparatus
Grant 9,352,542 - Inao , et al. May 31, 2
2016-05-31
Attaching device and attaching method
Grant 9,337,074 - Inao , et al. May 10, 2
2016-05-10
Laminate and method for separating the same
Grant 9,308,715 - Imai , et al. April 12, 2
2016-04-12
Substrate processing apparatus and substrate processing method
Grant 9,281,225 - Inao March 8, 2
2016-03-08
Sticking apparatus and sticking method
Grant 9,272,494 - Nakamura , et al. March 1, 2
2016-03-01
Supporting member separation apparatus and supporting member separation method
Grant 9,238,357 - Takase , et al. January 19, 2
2016-01-19
Attachment Method
App 20160005635 - Inao; Yoshihiro ;   et al.
2016-01-07
Attaching Apparatus
App 20150325463 - KATSURAGAWA; Junichi ;   et al.
2015-11-12
Supporting Member Separation Method
App 20150325465 - Iwata; Yasumasa ;   et al.
2015-11-12
Attaching Device And Attaching Method
App 20150262858 - Inao; Yoshihiro ;   et al.
2015-09-17
Laminate and method for separating the same
Grant 9,048,311 - Inao , et al. June 2, 2
2015-06-02
Processing Method And Processing Apparatus
App 20150013917 - Inao; Yoshihiro ;   et al.
2015-01-15
Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate
Grant 8,931,535 - Nakamura , et al. January 13, 2
2015-01-13
Bonding Method And Bonding Apparatus
App 20140374017 - Miyanari; Atsushi ;   et al.
2014-12-25
Sticking Apparatus And Sticking Method
App 20140332147 - Nakamura; Akihiko ;   et al.
2014-11-13
Perforated support plate
Grant 8,882,096 - Nakamura , et al. November 11, 2
2014-11-11
Supporting Member Separation Apparatus And Supporting Member Separation Method
App 20140318714 - Takase; Shinji ;   et al.
2014-10-30
Laminated Body And Method For Separating Laminated Body
App 20140311680 - Kubo; Atsushi ;   et al.
2014-10-23
Laminate And Method For Separating The Same
App 20140166209 - Imai; Hirofumi ;   et al.
2014-06-19
Transport Arm, Transport Apparatus And Transport Method
App 20140169929 - Inao; Yoshihiro ;   et al.
2014-06-19
Perforated Support Plate
App 20130333833 - NAKAMURA; Akihiko ;   et al.
2013-12-19
Laminate And Method For Separating The Same
App 20130220554 - Inao; Yoshihiro ;   et al.
2013-08-29
Laminate And Method For Separating The Same
App 20130213582 - Inao; Yoshihiro ;   et al.
2013-08-22
Liquid solvent abutment unit
Grant 8,449,691 - Nakamura , et al. May 28, 2
2013-05-28
Substrate Processing Apparatus And Substrate Processing Method
App 20130113147 - Inao; Yoshihiro
2013-05-09
Adhesive composition and adhesive film
Grant 8,426,543 - Asai , et al. April 23, 2
2013-04-23
Stripping device and stripping method
Grant 8,377,256 - Nakada , et al. February 19, 2
2013-02-19
Support plate, method for producing the same, and method for processing substrate
Grant 8,354,157 - Imai , et al. January 15, 2
2013-01-15
Stripping Device And Stripping Method
App 20130000852 - NAKADA; Kimihiro ;   et al.
2013-01-03
Stripping device and stripping method
Grant 8,302,651 - Nakada , et al. November 6, 2
2012-11-06
Sticking method and sticking apparatus
Grant 8,298,365 - Imai , et al. October 30, 2
2012-10-30
Separating apparatus and separating method
Grant 8,297,331 - Inao , et al. October 30, 2
2012-10-30
Attaching Device And Attaching Apparatus For Supporting Plate, And Attaching Method For Supporting Plate
App 20120132359 - NAKAMURA; Akihiko ;   et al.
2012-05-31
Separating device
Grant 8,186,410 - Nakamura , et al. May 29, 2
2012-05-29
Laminate And Method For Separating The Same
App 20120118511 - Imai; Hirofumi ;   et al.
2012-05-17
Method of thinning wafer and support plate
Grant 8,167,687 - Nakamura , et al. May 1, 2
2012-05-01
Adhesive composition and adhesive film
Grant 8,163,836 - Misumi , et al. April 24, 2
2012-04-24
Adhesive composition and film adhesive
Grant 8,148,457 - Asai , et al. April 3, 2
2012-04-03
Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate
Grant 8,136,564 - Nakamura , et al. March 20, 2
2012-03-20
Method of cleaning support plate
Grant 8,097,087 - Mitake , et al. January 17, 2
2012-01-17
Method of bonding, thinning, and releasing wafer
Grant 8,080,121 - Inao December 20, 2
2011-12-20
Supporting plate, apparatus and method for stripping supporting plate
Grant 8,080,123 - Nakamura , et al. December 20, 2
2011-12-20
Stripping Device And Stripping Method
App 20110259527 - Nakada; Kimihiro ;   et al.
2011-10-27
Process for producing an adhesive composition
Grant 7,999,052 - Asai , et al. August 16, 2
2011-08-16
Supporting Plate, Apparatus And Method For Stripping Supporting Plate
App 20110146899 - NAKAMURA; Akihiko ;   et al.
2011-06-23
Method for thinning substrate and method for manufacturing circuit device
Grant 7,919,394 - Nakamura , et al. April 5, 2
2011-04-05
Sticking Method And Sticking Apparatus
App 20100314043 - IMAI; Hirofumi ;   et al.
2010-12-16
Stripping device and stripping apparatus
Grant 7,849,905 - Nakamura , et al. December 14, 2
2010-12-14
Support Plate, Method For Producing The Same, And Method For Processing Substrate
App 20100310817 - IMAI; Hirofumi ;   et al.
2010-12-09
Adhesive Composition, Film Adhesive, And Process For Production Of The Composition
App 20100227996 - Asai; Takahiro ;   et al.
2010-09-09
Adhesive Composition, Film Adhesive, And Process For Production Of The Composition
App 20100178497 - Asai; Takahiro ;   et al.
2010-07-15
Adhesive Composition And Film Adhesive
App 20100075141 - Asai; Takahiro ;   et al.
2010-03-25
Adhesive Composition And Adhesive Film
App 20100069593 - Asai; Takahiro ;   et al.
2010-03-18
Liquid Solvent Abutment Unit
App 20100024853 - Nakamura; Akihiko ;   et al.
2010-02-04
Separating Apparatus And Separating Method
App 20100000680 - INAO; Yoshihiro ;   et al.
2010-01-07
Method of Thinning Wafer and Support plate
App 20090325467 - Nakamura; Akihiko ;   et al.
2009-12-31
Supporting plate peeling apparatus
App 20090314438 - Iwata; Yasumasa ;   et al.
2009-12-24
Support plate, carrier device, releasing device, and releasing method
App 20090305617 - Nakamura; Akihiro ;   et al.
2009-12-10
Perforated Support Plate
App 20090288780 - Nakamura; Akihiko ;   et al.
2009-11-26
Method Of Bonding, Thinning, And Releasing Wafer
App 20090199957 - Inao; Yoshihiro
2009-08-13
Separating Device
App 20090139662 - Nakamura; Akihiko ;   et al.
2009-06-04
Adhesive Composition And Adhesive Film
App 20090137760 - Misumi; Koichi ;   et al.
2009-05-28
Supporting plate
Grant D552,565 - Nakamura , et al. October 9, 2
2007-10-09
Substrate attaching method
Grant 7,268,061 - Miyanari , et al. September 11, 2
2007-09-11
Developing apparatus and method
Grant 7,237,967 - Nakamura , et al. July 3, 2
2007-07-03
Supporting plate
Grant D544,452 - Nakamura , et al. June 12, 2
2007-06-12
Stripping device and stripping apparatus
App 20070125751 - Nakamura; Akihiko ;   et al.
2007-06-07
Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate
App 20070125495 - Nakamura; Akihiko ;   et al.
2007-06-07
Supporting plate, and method for attaching supporting plate
App 20070128832 - Nakamura; Akihiko ;   et al.
2007-06-07
Supporting plate, apparatus, and method for stripping supporting plate
App 20070062644 - Nakamura; Akihiko ;   et al.
2007-03-22
Method for thinning substrate and method for manufacturing circuit device
App 20070054470 - Nakamura; Akihiko ;   et al.
2007-03-08
Developing apparatus and method
App 20050180744 - Nakamura, Akihiko ;   et al.
2005-08-18
Substrate attaching method
App 20050170612 - Miyanari, Atsushi ;   et al.
2005-08-04
Developing apparatus and developing method
Grant 6,893,172 - Nakamura , et al. May 17, 2
2005-05-17
Developing apparatus and developing method
App 20040165883 - Nakamura, Akihiko ;   et al.
2004-08-26

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