loadpatents
Patent applications and USPTO patent grants for Inagaki; Yasushi.The latest application filed is for "lens driving device, camera module, and method for manufacturing lens driving device".
Patent | Date |
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Lens driving device, camera module, and method for manufacturing lens driving device Grant 10,409,026 - Inagaki , et al. Sept | 2019-09-10 |
Printed wiring board Grant 10,134,693 - Inagaki November 20, 2 | 2018-11-20 |
Lens Driving Device, Camera Module, And Method For Manufacturing Lens Driving Device App 20180259741 - INAGAKI; Yasushi ;   et al. | 2018-09-13 |
Package substrate Grant 9,854,669 - Inagaki , et al. December 26, 2 | 2017-12-26 |
Printed wiring board Grant 9,793,241 - Inagaki October 17, 2 | 2017-10-17 |
Package substrate and method for manufacturing package substrate Grant 9,763,319 - Inagaki , et al. September 12, 2 | 2017-09-12 |
Printed Wiring Board App 20170213799 - INAGAKI; Yasushi | 2017-07-27 |
Package substrate and method for manufacturing package substrate Grant 9,716,059 - Inagaki , et al. July 25, 2 | 2017-07-25 |
Printed wiring board and method for manufacturing the same Grant 9,704,795 - Inagaki , et al. July 11, 2 | 2017-07-11 |
Wiring board with built-in electronic component Grant 9,699,909 - Ishiguro , et al. July 4, 2 | 2017-07-04 |
Printed Wiring Board App 20170154871 - INAGAKI; Yasushi | 2017-06-01 |
Printed wiring board Grant 9,655,242 - Inagaki , et al. May 16, 2 | 2017-05-16 |
Lens driving apparatus Grant 9,638,885 - Inagaki , et al. May 2, 2 | 2017-05-02 |
Printed wiring board and semiconductor package Grant 9,564,392 - Furutani , et al. February 7, 2 | 2017-02-07 |
Printed wiring board and method for manufacturing the same Grant 9,538,651 - Inagaki , et al. January 3, 2 | 2017-01-03 |
Printed wiring board and method for manufacturing the same Grant 9,510,447 - Furutani , et al. November 29, 2 | 2016-11-29 |
Printed wiring board and method for manufacturing the same Grant 9,510,450 - Furutani , et al. November 29, 2 | 2016-11-29 |
Printed Wiring Board And Semiconductor Package App 20160336261 - FURUTANI; Toshiki ;   et al. | 2016-11-17 |
Package substrate and method for manufacturing package substrate Grant 9,443,800 - Inagaki , et al. September 13, 2 | 2016-09-13 |
Multilayer Wiring Board App 20160255717 - FURUTANI; Toshiki ;   et al. | 2016-09-01 |
Printed Wiring Board App 20160174372 - INAGAKI; Yasushi ;   et al. | 2016-06-16 |
Package Substrate App 20160164159 - INAGAKI; Yasushi ;   et al. | 2016-06-09 |
Package Substrate App 20160086885 - INAGAKI; Yasushi ;   et al. | 2016-03-24 |
Printed Wiring Board And Method For Manufacturing The Same App 20160081190 - INAGAKI; Yasushi ;   et al. | 2016-03-17 |
Package substrate Grant 9,287,250 - Inagaki , et al. March 15, 2 | 2016-03-15 |
Package Substrate And Method For Manufacturing Package Substrate App 20160064318 - INAGAKI; Yasushi ;   et al. | 2016-03-03 |
Package substrate Grant 9,263,784 - Inagaki , et al. February 16, 2 | 2016-02-16 |
Printed Wiring Board And Method For Manufacturing The Same App 20160044780 - INAGAKI; Yasushi ;   et al. | 2016-02-11 |
Printed Wiring Board And Semiconductor Package App 20160043024 - FURUTANI; Toshiki ;   et al. | 2016-02-11 |
Printed Wiring Board And Method For Manufacturing The Same App 20160043027 - INAGAKI; Yasushi ;   et al. | 2016-02-11 |
Printed Wiring Board, Method For Manufacturing The Same And Semiconductor Package App 20160044783 - Furutani; Toshiki ;   et al. | 2016-02-11 |
Printed Wiring Board And Method For Manufacturing The Same App 20160021758 - FURUTANI; Toshiki ;   et al. | 2016-01-21 |
Printed Wiring Board And Method For Manufacturing The Same App 20160021759 - FURUTANI; Toshiki ;   et al. | 2016-01-21 |
Multilayer printed wiring board having multilayer core substrate Grant 9,226,397 - Inagaki , et al. December 29, 2 | 2015-12-29 |
Package Substrate App 20150357316 - INAGAKI; Yasushi ;   et al. | 2015-12-10 |
Package Substrate And Method For Manufacturing Package Substrate App 20150327363 - INAGAKI; Yasushi ;   et al. | 2015-11-12 |
Package Substrate App 20150318596 - INAGAKI; Yasushi ;   et al. | 2015-11-05 |
Package Substrate And Method For Manufacturing Package Substrate App 20150279772 - INAGAKI; Yasushi ;   et al. | 2015-10-01 |
Printed Circuit Board App 20150250056 - INAGAKI; Yasushi ;   et al. | 2015-09-03 |
Multilayer printed wiring board Grant 9,101,054 - Inagaki , et al. August 4, 2 | 2015-08-04 |
Lens Driving Apparatus App 20150212288 - INAGAKI; Yasushi ;   et al. | 2015-07-30 |
Printed circuit board Grant 9,060,446 - Inagaki , et al. June 16, 2 | 2015-06-16 |
Wiring Board With Built-in Electronic Component App 20150043183 - ISHIGURO; Naohito ;   et al. | 2015-02-12 |
Method For Manufacturing Wiring Board With Built-in Electronic Component App 20150040389 - ISHIGURO; Naohito ;   et al. | 2015-02-12 |
Package Substrate And Method For Manufacturing Package Substrate App 20140374150 - INAGAKI; Yasushi ;   et al. | 2014-12-25 |
Printed circuit board and method of manufacturing printed circuit board Grant 8,842,440 - Inagaki , et al. September 23, 2 | 2014-09-23 |
Printed circuit board and method of manufacturing printed circuit board Grant 8,830,691 - Inagaki , et al. September 9, 2 | 2014-09-09 |
Printed Circuit Board App 20140247572 - INAGAKI; Yasushi ;   et al. | 2014-09-04 |
Printed circuit board Grant 8,780,573 - Inagaki , et al. July 15, 2 | 2014-07-15 |
Method of manufacturing printed wiring board Grant 8,763,241 - Inagaki , et al. July 1, 2 | 2014-07-01 |
Multilayer printed wiring board Grant 8,754,334 - Inagaki , et al. June 17, 2 | 2014-06-17 |
Multilayer printed wiring board Grant 8,729,400 - Inagaki , et al. May 20, 2 | 2014-05-20 |
Printed circuit board Grant 8,717,772 - Inagaki , et al. May 6, 2 | 2014-05-06 |
Multilayer printed wiring board Grant 8,592,688 - Inagaki , et al. November 26, 2 | 2013-11-26 |
Multilayer Printed Wiring Board App 20130299218 - INAGAKI; Yasushi ;   et al. | 2013-11-14 |
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20130286615 - Inagaki; Yasushi ;   et al. | 2013-10-31 |
Multilayer printed wiring board Grant 8,569,880 - Inagaki , et al. October 29, 2 | 2013-10-29 |
Multilayer Printed Wiring Board App 20130248234 - Inagaki; Yasushi ;   et al. | 2013-09-26 |
Multilayer Printed Wiring Board App 20130206466 - Inagaki; Yasushi ;   et al. | 2013-08-15 |
Printed Circuit Board App 20130107482 - INAGAKI; Yasushi ;   et al. | 2013-05-02 |
Printed circuit board Grant 8,331,102 - Inagaki , et al. December 11, 2 | 2012-12-11 |
Multilayer Printed Wiring Board App 20120181078 - Inagaki; Yasushi ;   et al. | 2012-07-19 |
Multilayer printed wiring board Grant 8,119,920 - Inagaki , et al. February 21, 2 | 2012-02-21 |
Printed circuit board Grant 8,116,091 - Inagaki , et al. February 14, 2 | 2012-02-14 |
Multilayer printed wiring board Grant 8,110,750 - Inagaki , et al. February 7, 2 | 2012-02-07 |
Printed circuit board Grant 8,107,253 - Inagaki , et al. January 31, 2 | 2012-01-31 |
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20120006469 - INAGAKI; YASUSHI ;   et al. | 2012-01-12 |
Multilayer Printed Wiring Board App 20110303451 - INAGAKI; Yasushi ;   et al. | 2011-12-15 |
Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same Grant 8,021,748 - Asai , et al. September 20, 2 | 2011-09-20 |
Printed circuit board Grant 7,995,352 - Inagaki , et al. August 9, 2 | 2011-08-09 |
Printed circuit board Grant 7,978,478 - Inagaki , et al. July 12, 2 | 2011-07-12 |
Printed circuit board Grant 7,881,069 - Inagaki , et al. February 1, 2 | 2011-02-01 |
Printed circuit board Grant 7,864,543 - Inagaki , et al. January 4, 2 | 2011-01-04 |
Printed circuit board Grant 7,864,542 - Inagaki , et al. January 4, 2 | 2011-01-04 |
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20100328915 - INAGAKI; Yasushi ;   et al. | 2010-12-30 |
Multilayer Printed Wiring Board App 20100321914 - INAGAKI; Yasushi ;   et al. | 2010-12-23 |
Printed circuit board Grant 7,855,894 - Inagaki , et al. December 21, 2 | 2010-12-21 |
Multilayer printed wiring board Grant 7,800,216 - Inagaki , et al. September 21, 2 | 2010-09-21 |
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20100226108 - INAGAKI; Yasushi ;   et al. | 2010-09-09 |
Printed Circuit Board App 20100118502 - INAGAKI; Yasushi ;   et al. | 2010-05-13 |
Multilayer Printed Wiring Board App 20100101838 - Inagaki; Yasushi ;   et al. | 2010-04-29 |
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20100014261 - INAGAKI; Yasushi ;   et al. | 2010-01-21 |
Multilayer Printed Wiring Board App 20090266588 - Inagaki; Yasushi ;   et al. | 2009-10-29 |
Multilayer Printed Wiring Board App 20090090542 - INAGAKI; Yasushi ;   et al. | 2009-04-09 |
Multilayer printed wiring board Grant 7,507,913 - Inagaki , et al. March 24, 2 | 2009-03-24 |
Multilayer Printed Wiring Board App 20080296052 - INAGAKI; Yasushi ;   et al. | 2008-12-04 |
Printed Circuit Board And Method Of Manufacturing Printed Ciruit Board App 20080169120 - Inagaki; Yasushi ;   et al. | 2008-07-17 |
Printed Circuit Board And Method For Manufacturing Printed Circuit Board App 20080158841 - INAGAKI; Yasushi ;   et al. | 2008-07-03 |
Printed Circuit Board And Method For Manufacturing Printed Circuit Board App 20080158838 - INAGAKI; Yasushi ;   et al. | 2008-07-03 |
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20080142255 - Inagaki; Yasushi ;   et al. | 2008-06-19 |
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20080144298 - Inagaki; Yasushi ;   et al. | 2008-06-19 |
Printed circuit board and method of manufacturing printed circuit board Grant 7,342,803 - Inagaki , et al. March 11, 2 | 2008-03-11 |
Printed Circuit Board And Method For Manufacturing Printed Circuit Board App 20080055872 - INAGAKI; Yasushi ;   et al. | 2008-03-06 |
Interlayer Dielectric Layer For Printed Wiring Board, Printed Wiring Board, And Method Of Producing The Same App 20080023815 - ASAI; Motoo ;   et al. | 2008-01-31 |
Interlayer Dielectric Layer For Printed Wiring Board, Printed Wiring Board, And Method Of Producing The Same App 20080014336 - ASAI; Motoo ;   et al. | 2008-01-17 |
Printed circuit board and method for manufacturing printed circuit board Grant 7,307,852 - Inagaki , et al. December 11, 2 | 2007-12-11 |
Printed Circuit Board And Method Of Manufacturing Printed Ciruit Board App 20070258225 - Inagaki; Yasushi ;   et al. | 2007-11-08 |
Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same App 20070013049 - Asai; Motoo ;   et al. | 2007-01-18 |
Multilayer printed wiring board App 20060244134 - Inagaki; Yasushi ;   et al. | 2006-11-02 |
Multilayer printed wiring board App 20060243478 - Inagaki; Yasushi ;   et al. | 2006-11-02 |
Multilayer printed wiring board App 20050236177 - Inagaki, Yasushi ;   et al. | 2005-10-27 |
Printed circuit board and method for manufacturing printed circuit board App 20050157478 - Inagaki, Yasushi ;   et al. | 2005-07-21 |
Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board Grant 6,876,554 - Inagaki , et al. April 5, 2 | 2005-04-05 |
Printed circuit board and method of manufacturing printed circuit board App 20040160751 - Inagaki, Yasushi ;   et al. | 2004-08-19 |
Printed wiring board and method of producing the same Grant 6,724,638 - Inagaki , et al. April 20, 2 | 2004-04-20 |
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